Inventor · disambiguated record
Hiroyuki Horikawa
Also filed as: HORIKAWA HIROYUKI
3 granted patents·1 pending application·3 citations·filing 2010–2021
54Inventor score
Top patents by PatentIndex Score
4 records- 0155US8411173B2Black level correction circuit and solid-state imaging deviceHORIKAWA HIROYUKI·Filed 2010·Granted Apr 2, 2013·1 cites·14 claims
- 0245US11278945B2Die set and working method using the die setNIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD·Filed 2018·Granted Mar 22, 2022·0 cites·11 claims
- 0343US2022402010A1Die set and processing method using die setNIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD·Filed 2021·Application pending·0 cites
- 0432USD914775SBending die for metal plateNIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD·Filed 2018·Granted Mar 30, 2021·2 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Hiroyuki Horikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →