Inventor · disambiguated record
Nobutaka Mizutani
Also filed as: MIZUTANI NOBUTAKA
20 granted patents·9 pending applications·8 citations·filing 2003–2020
89Inventor score
Top patents by PatentIndex Score
29 records- 0175US10731256B2Plating apparatus, plating method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 4, 2020·2 cites·6 claims
- 0273US10224208B2Plating method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted Mar 5, 2019·2 cites·3 claims
- 0370US11519074B2Plating method and recording mediumTOKYO ELECTRON LTD·Filed 2020·Granted Dec 6, 2022·0 cites·3 claims
- 0467US9711363B2Plating method, recording medium and plating systemTOKYO ELECTRON LTD·Filed 2016·Granted Jul 18, 2017·1 cites·6 claims
- 0563US9966306B2Catalyst layer forming method, catalyst layer forming system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Granted May 8, 2018·1 cites·13 claims
- 0656US11004684B2Forming method of hard maskTOKYO ELECTRON LTD·Filed 2019·Granted May 11, 2021·0 cites·4 claims
- 0753US10224202B2Forming method of hard mask, forming apparatus of hard mask and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 0852US9650717B2Pre-treatment method of plating, storage medium, and plating systemTOKYO ELECTRON LTD·Filed 2015·Granted May 16, 2017·0 cites·5 claims
- 0951US9653354B2Metal wiring layer forming method, metal wiring layer forming apparatus, and recording mediumTOKYO ELECTRON LTD·Filed 2014·Granted May 16, 2017·0 cites·16 claims
- 1049US9725810B2Plating method, plating apparatus and storage mediumMIZUTANI NOBUTAKA·Filed 2012·Granted Aug 8, 2017·0 cites·9 claims
- 1149US7176142B2Method of manufacturing trench structure for deviceTOKYO ELECTRON LTD·Filed 2003·Granted Feb 13, 2007·2 cites·16 claims
- 1247US9653350B2Pre-treatment method for plating and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted May 16, 2017·0 cites·6 claims
- 1347US2017121822A1Plating apparatus, plating method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 1446US9552994B2Plating apparatus, plating method, and storage mediumTOKYO ELECTRON LTD·Filed 2013·Granted Jan 24, 2017·0 cites·7 claims
- 1545US9837308B2Plating method, plating system and storage mediumTOKYO ELECTRON LTD·Filed 2013·Granted Dec 5, 2017·0 cites·6 claims
- 1644US10755973B2Metal wiring layer forming method, metal wiring layer forming apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 25, 2020·0 cites·8 claims
- 1744US9888585B2Method for manufacturing wiring structure, copper displacement plating solution, and wiring structureTOKYO ELECTRON LTD·Filed 2015·Granted Feb 6, 2018·0 cites·4 claims
- 1843US10138556B2Plating method, plating apparatus, and storage mediumTOKYO ELECTRON LTD·Filed 2013·Granted Nov 27, 2018·0 cites·7 claims
- 1943US10030308B2Plating method, plating system and storage mediumTOKYO ELECTRON LTD·Filed 2013·Granted Jul 24, 2018·0 cites·6 claims
- 2042US2015218702A1Electroless plating method, electroless plating apparatus and storage mediumTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 2142US2009107521A1Chemical solution or pure water feeder, substrate processing system, substrate processing apparatus, or substrate processing methodUNIV TOHOKU·Filed 2007·Application pending·0 cites
- 2242US2015167174A1Plating apparatus, plating method, and storage mediumTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 2341US2007148985A1Method of manufacturing trench structure for deviceMIZUTANI NOBUTAKA·Filed 2007·Application pending·0 cites
- 2440US10179950B2Plating method, plated component, and plating systemTOKYO ELECTRON LTD·Filed 2016·Granted Jan 15, 2019·0 cites·7 claims
- 2539US2021115565A1Plating method, plating apparatus and recording mediumTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 2638US2021108316A1Plating method, plating system, and recording mediumTOKYO ELECTRON LTD·Filed 2018·Application pending·0 cites
- 2736US8741070B2Liquid processing method, liquid processing apparatus and recording mediumMIZUTANI NOBUTAKA·Filed 2011·Granted Jun 3, 2014·0 cites·7 claims
- 2836US2017084480A1Substrate processing apparatus, substrate processing method and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 2935US2016247765A1Semiconductor device, plating method, plating system and recording mediumTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →