Inventor · disambiguated record
Byung-Kwon Cho
Also filed as: CHO BYUNG-KWON
18 granted patents·4 pending applications·155 citations·filing 2011–2021
93Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12HARVEST CHARMFOODS CO LTD2JO BYUNG CHUL2PARK SANG-JINE2CHO BYOUNG-CHOL1
Top patents by PatentIndex Score
22 records- 0189US9929099B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·7 cites·15 claims
- 0288US10192973B2Methods of forming semiconductor devices including trench walls having multiple slopesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 29, 2019·5 cites·17 claims
- 0386US9443979B2Semiconductor devices including trench walls having multiple slopesPARK SANG-JINE·Filed 2014·Granted Sep 13, 2016·7 cites·20 claims
- 0486US9117692B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 25, 2015·7 cites·12 claims
- 0585US9334087B2Standing pouchCHO BYOUNG-CHOL·Filed 2011·Granted May 10, 2016·28 cites·12 claims
- 0684USD705061SSpout capHARVEST CHARMFOODS CO LTD·Filed 2012·Granted May 20, 2014·45 cites·1 claims
- 0783US10985036B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 20, 2021·3 cites·17 claims
- 0881USD705062SSpout capJO BYUNG-CHUL·Filed 2012·Granted May 20, 2014·35 cites·1 claims
- 0980US8946026B2Methods of fabricating a semiconductor device including metal gate electrodesCHOI SUKHUN·Filed 2011·Granted Feb 3, 2015·6 cites·28 claims
- 1079US8889552B2Semiconductor device having dual metal silicide layers and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·12 claims
- 1175US9812353B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·2 cites·20 claims
- 1269US8735239B2Semiconductor devices including compressive stress patterns and methods of fabricating the samePARK SANGJINE·Filed 2011·Granted May 27, 2014·3 cites·13 claims
- 1364US9040415B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·1 cites·20 claims
- 1462US11887868B2Substrate processing apparatus and apparatus for manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·17 claims
- 1554US9984921B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 29, 2018·0 cites·20 claims
- 1650US10186485B2Planarized interlayer dielectric with air gap isolationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 22, 2019·0 cites·20 claims
- 1745US2016318684A1Pouch containerMONDI KSP CO LTD·Filed 2013·Application pending·0 cites
- 1844US2014102436A1Pouch and method for manufacturing sameJO BYUNG-CHUL·Filed 2012·Application pending·0 cites
- 1944US2015336731A1Vertical pouchHARVEST CHARMFOODS CO LTD·Filed 2012·Application pending·0 cites
- 2043US10818522B2Process chamber for a supercritical process and apparatus for treating substrates having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·17 claims
- 2142US11302526B2Supercritical drying apparatus and method of drying substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 12, 2022·0 cites·17 claims
- 2238US2012049250A1Semiconductor Integrated Circuit Device Including an Epitaxial LayerPARK SANG-JINE·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Byung-Kwon Cho files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →