Inventor · disambiguated record
Masashi Takenaka
Also filed as: TAKENAKA MASASHI
23 granted patents·3 pending applications·1,253 citations·filing 1992–2015
97Inventor score
Top patents by PatentIndex Score
26 records- 0197US5726493ASemiconductor device and semiconductor device unit having ball-grid-array type package structureFUJITSU LTD·Filed 1997·Granted Mar 10, 1998·516 cites·9 claims
- 0292US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0392US5920117ASemiconductor device and method of forming the deviceFUJITSU LTD·Filed 1997·Granted Jul 6, 1999·135 cites·12 claims
- 0490US7564111B2Imaging apparatusFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Jul 21, 2009·15 cites·15 claims
- 0587US6347037B2Semiconductor device and method of forming the sameFUJITSU LTD·Filed 1998·Granted Feb 12, 2002·99 cites·14 claims
- 0683US6184133B1Method of forming an assembly board with insulator filled through holesFUJITSU LTD·Filed 2000·Granted Feb 6, 2001·26 cites·7 claims
- 0781US5831441ATest board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor deviceFUJITSU LTD·Filed 1996·Granted Nov 3, 1998·58 cites·2 claims
- 0880US5656864ASemiconductor device having upper and lower package bodies and manufacturing method thereofFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·75 cites·9 claims
- 0978US7193320B2Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2003·Granted Mar 20, 2007·24 cites·12 claims
- 1071US6268645B1Semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jul 31, 2001·18 cites·12 claims
- 1171US5444025AProcess for encapsulating a semiconductor package having a heat sink using a jigFUJITSU LTD·Filed 1994·Granted Aug 22, 1995·39 cites·12 claims
- 1270US5750421ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1997·Granted May 12, 1998·27 cites·4 claims
- 1370US5475259ASemiconductor device and carrier for carrying semiconductor deviceFUJITSU LTD·Filed 1992·Granted Dec 12, 1995·29 cites·24 claims
- 1468US5666064ASemiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor deviceFUJITSU LTD·Filed 1995·Granted Sep 9, 1997·25 cites·7 claims
- 1566US9355974B2Semiconductor device and manufacturing method thereforSOCIONEXT INC·Filed 2015·Granted May 31, 2016·1 cites·3 claims
- 1664US5729435ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Mar 17, 1998·22 cites·6 claims
- 1750US6088233ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1998·Granted Jul 11, 2000·11 cites·11 claims
- 1849US5978222ASemiconductor device and assembly board having through-holes filled with filling coreFUJITSU LTD·Filed 1997·Granted Nov 2, 1999·11 cites·9 claims
- 1947US2007114642A1Semiconductor device having a heat spreader exposed from a seal resinFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2045US5889333ASemiconductor device and method for manufacturing suchFUJITSU LTD·Filed 1997·Granted Mar 30, 1999·12 cites·10 claims
- 2145US5736428AProcess for manufacturing a semiconductor device having a stepped encapsulated packageFUJITSU LTD·Filed 1997·Granted Apr 7, 1998·8 cites·8 claims
- 2245US5659200ASemiconductor device having radiator structureFUJITSU LTD·Filed 1995·Granted Aug 19, 1997·11 cites·12 claims
- 2343US9142516B2Semiconductor device and manufacturing method thereforTAKENAKA MASASHI·Filed 2012·Granted Sep 22, 2015·0 cites·5 claims
- 2438US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 2534US6342729B1Tape carrier packageFUJITSU LTD·Filed 1999·Granted Jan 29, 2002·6 cites·5 claims
- 2630US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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