Inventor · disambiguated record
Gari Arutinov
Also filed as: ARUTINOV GARI
10 granted patents·4 pending applications·4 citations·filing 2014–2022
77Inventor score
Top patents by PatentIndex Score
14 records- 0177US11173737B2Method and system for applying a patterned structure on a surfaceTNO·Filed 2017·Granted Nov 16, 2021·1 cites·12 claims
- 0277US10304797B2Apparatus and method for soldering a plurality of chips using a flash lamp and a maskTNO·Filed 2016·Granted May 28, 2019·3 cites·15 claims
- 0359US2015375487A1Roll-to-roll apparatus and method for manufacturing a product comprising a target substrate provided with at least one foil shaped componentTNO·Filed 2014·Application pending·0 cites
- 0455US11691199B2Method and apparatus for creating and sintering fine lines and patternsTNO·Filed 2019·Granted Jul 4, 2023·0 cites·15 claims
- 0552US2025204119A1Multi-layer release stack for light induced transfer of componentsTNO·Filed 2022·Application pending·0 cites
- 0649US10338473B2Method and system for forming a patterned structure on a substrateTNO·Filed 2014·Granted Jul 2, 2019·0 cites·10 claims
- 0746US11840097B2High resolution laser induced forward transferTNO·Filed 2019·Granted Dec 12, 2023·0 cites·20 claims
- 0845US12431381B2Light induced selective transfer of components between substratesTNO·Filed 2020·Granted Sep 30, 2025·0 cites·14 claims
- 0944US9918392B2Method and apparatus for assembling a component with a flexible foil, as well as the assembled productTNO·Filed 2014·Granted Mar 13, 2018·0 cites·14 claims
- 1041US11825610B2Process for the manufacturing of printed conductive tracks on an object and 3D printed electronicsTNO·Filed 2019·Granted Nov 21, 2023·0 cites·11 claims
- 1138US11476228B2Method and system for bonding a chip to a substrateTNO·Filed 2017·Granted Oct 18, 2022·0 cites·11 claims
- 1238US2021087670A1Lift deposition apparatus and methodTNO·Filed 2019·Application pending·0 cites
- 1335US11282821B2Light induced selective transfer of componentsTNO·Filed 2018·Granted Mar 22, 2022·0 cites·20 claims
- 1435US2019301006A1Composition Suitable for Application with Laser Induced Forward Transfer (LIFT)HENKEL AG & CO KGAA·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →