Inventor · disambiguated record
Hideaki Awata
Also filed as: AWATA HIDEAKI
13 granted patents·8 pending applications·20 citations·filing 2006–2019
86Inventor score
Top patents by PatentIndex Score
21 records- 0186US10475631B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Nov 12, 2019·3 cites·2 claims
- 0283US10087517B2Oxide sintered body and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Oct 2, 2018·4 cites·7 claims
- 0383US7871667B2Method of operating vacuum deposition apparatus and vacuum deposition apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jan 18, 2011·7 cites·2 claims
- 0482US10655213B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted May 19, 2020·2 cites·4 claims
- 0564US8142923B2BatteryEMURA KATSUJI·Filed 2007·Granted Mar 27, 2012·3 cites·6 claims
- 0662US2008083506A1Feeding mechanism for continuous processing of elongate base material, processing apparatus and thin film forming apparatus using the same, and elongate member produced therebySUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Application pending·0 cites
- 0757US2011095121A1Feeding mechanism for continuous processing of elongate base material, processing apparatus and thin film forming apparatus using the same, and elongate member produced therebySUMITOMO ELECTRIC INDUSTRIES·Filed 2011·Application pending·0 cites
- 0853US10811238B2Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Oct 20, 2020·0 cites·6 claims
- 0948US10822276B2Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Nov 3, 2020·0 cites·14 claims
- 1048US7946247B2Coating layer thickness measurement mechanism and coating layer forming apparatus using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted May 24, 2011·1 cites·5 claims
- 1145US10894744B2Oxide sintered material and method for manufacturing the same, sputtering target, and method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Jan 19, 2021·0 cites·10 claims
- 1243US2017222058A1Semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1342US10192994B2Oxide semiconductor film including indium, tungsten and zinc and thin film transistor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Jan 29, 2019·0 cites·8 claims
- 1441US11616148B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceMITSUI MINING & SMELTING CO LTD·Filed 2017·Granted Mar 28, 2023·0 cites·12 claims
- 1540US11492694B2Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Nov 8, 2022·0 cites·3 claims
- 1640US11024744B2Semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Jun 1, 2021·0 cites·20 claims
- 1736US2017152425A1AlN SINTERED COMPACT, AlN SUBSTRATE AND METHOD OF PRODUCING AlN SUBSTRATESUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
- 1835US2019140104A1Semiconductor device and method for manufacturing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Application pending·0 cites
- 1935US2020126790A1Oxide sintered material and method of manufacturing the same, sputtering target, oxide semiconductor film, and method of manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 2034US2019194784A1Aqueous Solution Composition and Method for Manufacturing the Same, Oxide Powder and Method for Manufacturing the Same, Carbide Powder and Method for Manufacturing the Same, and Cemented Carbide and Method for Manufacturing the SameSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Application pending·0 cites
- 2132US2016251264A1Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
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