Inventor · disambiguated record
Tae-Sung Yoon
Also filed as: YOON TAE S · YOON TAE-SUNG
33 granted patents·7 pending applications·324 citations·filing 2004–2024
97Inventor score
Files withSPIGEN KOREA CO LTD24SAMSUNG ELECTRONICS CO LTD10YOON TAE-SUNG2RYU SEONG EON1SHIN MU-SEOB1
Top patents by PatentIndex Score
40 records- 0198US7550830B2Stacked semiconductor package having fan-out structure through wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 23, 2009·33 cites·20 claims
- 0297USD999199SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2020·Granted Sep 19, 2023·27 cites·1 claims
- 0395USD883925SPortable chargerSPIGEN KOREA CO LTD·Filed 2019·Granted May 12, 2020·52 cites·1 claims
- 0495US7327032B2Semiconductor package accomplishing fan-out structure through wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 5, 2008·17 cites·26 claims
- 0594USD1053177SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2023·Granted Dec 3, 2024·13 cites·1 claims
- 0692US7368821B2BGA semiconductor chip package and mounting structure thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·26 cites·20 claims
- 0791USD1001113SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2020·Granted Oct 10, 2023·15 cites·1 claims
- 0885USD888702SWireless battery case for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Jun 30, 2020·23 cites·1 claims
- 0982USD905633SCharging stand for electronic devicesSPIGEN KOREA CO LTD·Filed 2019·Granted Dec 22, 2020·18 cites·1 claims
- 1077US11949445B2Protective case having card storages for portable electronic deviceSPIGEN KOREA CO LTD·Filed 2022·Granted Apr 2, 2024·1 cites·3 claims
- 1177US7485959B2Structure for joining a semiconductor package to a substrate using a solder columnSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·2 cites·14 claims
- 1276USD914007SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2020·Granted Mar 23, 2021·6 cites·1 claims
- 1375US12212700B2Folding case with rotating side coverSPIGEN KOREA CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·8 claims
- 1475US12160535B2Folding case with rotating side coverSPIGEN KOREA CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·8 claims
- 1575US2025119486A1Folding case with rotating side coverSPIGEN KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1674US7371618B2Method of manufacturing wafer-level chip-size package and molding apparatus used in the methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 13, 2008·9 cites·6 claims
- 1769US6946328B2Method for manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 20, 2005·17 cites·20 claims
- 1868USD900085SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Oct 27, 2020·10 cites·1 claims
- 1967USD901478SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Nov 10, 2020·9 cites·1 claims
- 2067USD900083SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Oct 27, 2020·9 cites·1 claims
- 2166US8294250B2Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrateYOON TAE-SUNG·Filed 2010·Granted Oct 23, 2012·3 cites·11 claims
- 2266US2009212412A1Semiconductor package accomplishing fan-out structure through wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2361USD909969SWall chargerSPIGEN KOREA CO LTD·Filed 2019·Granted Feb 9, 2021·7 cites·1 claims
- 2461USD905682SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Dec 22, 2020·7 cites·1 claims
- 2561US7732905B2Stack package and semiconductor module implementing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 8, 2010·2 cites·19 claims
- 2657USD914006SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Mar 23, 2021·6 cites·1 claims
- 2756US8116088B2Semiconductor package and method of forming the same, and printed circuit boardSHIN MU-SEOB·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims
- 2855US8298775B2Method for diagnosis of disease using quantitative monitoring of protein tyrosine phosphataseRYU SEONG EON·Filed 2008·Granted Oct 30, 2012·1 cites·20 claims
- 2953USD1040146SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2022·Granted Aug 27, 2024·1 cites·1 claims
- 3053US2008187613A1Method of manufacturing wafer-level chip-size package and molding apparatus used in the methodYOON TAE-SUNG·Filed 2008·Application pending·0 cites
- 3150USD905037SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Dec 15, 2020·4 cites·1 claims
- 3245USD946512SCharging stand for electronic devicesSPIGEN KOREA CO LTD·Filed 2019·Granted Mar 22, 2022·3 cites·1 claims
- 3345US2007098831A1Mold for injection moldingYOON TAE S·Filed 2006·Application pending·0 cites
- 3444US2008111284A1Method of manufacturing a molding structure, and method and apparatus for molding a substrate using the molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3544US2008308935A1Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3636USD900084SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Oct 27, 2020·1 cites·1 claims
- 3736US2018299440A1High-density western blot array analysis methodT MAC CO LTD·Filed 2018·Application pending·0 cites
- 3832USD906322SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·1 claims
- 3932USD905683SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·1 claims
- 4031USD1065163SCase for electronic communications deviceSPIGEN KOREA CO LTD·Filed 2020·Granted Mar 4, 2025·0 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →