Inventor · disambiguated record
Roger M. Arbuthnot
Also filed as: ARBUTHNOT ROGER · ARBUTHNOT ROGER M
17 granted patents·1 pending application·16 citations·filing 2006–2023
88Inventor score
Top patents by PatentIndex Score
18 records- 0185US7495323B2Semiconductor package structure having multiple heat dissipation paths and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Feb 24, 2009·14 cites·18 claims
- 0281US12417957B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0374US11842942B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 12, 2023·0 cites·21 claims
- 0467US11282764B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 0563US2019326202A1Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Application pending·0 cites
- 0662US7935575B2Method of forming a semiconductor package and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 3, 2011·2 cites·10 claims
- 0759US10490488B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 0858US10325835B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 0957US10522448B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Dec 31, 2019·0 cites·18 claims
- 1057US9576883B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 21, 2017·0 cites·20 claims
- 1157US9379193B2Semiconductor package for a lateral device and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 28, 2016·0 cites·5 claims
- 1256US9558968B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jan 31, 2017·0 cites·16 claims
- 1355US9397028B2Semiconductor devices and methods of making the sameSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted Jul 19, 2016·0 cites·20 claims
- 1454US9870986B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 1550US9646919B2Semiconductor package for a lateral device and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 9, 2017·0 cites·14 claims
- 1649US9070721B2Semiconductor devices and methods of making the sameARBUTHNOT ROGER M·Filed 2013·Granted Jun 30, 2015·0 cites·17 claims
- 1747US8384206B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2011·Granted Feb 26, 2013·0 cites·10 claims
- 1843US11107753B2Packaging structure for gallium nitride devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 31, 2021·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →