Inventor · disambiguated record
Yoshinori Kon
Also filed as: KON YOSHINORI
7 granted patents·5 pending applications·17 citations·filing 2000–2020
79Inventor score
Top patents by PatentIndex Score
12 records- 0181US7618723B2Glass substrate for magnetic disk, its production method and magnetic diskASAHI GLASS CO LTD·Filed 2007·Granted Nov 17, 2009·5 cites·16 claims
- 0271US7857680B2Method for producing glass substrate for magnetic disk, and magnetic diskASAHI GLASS CO LTD·Filed 2007·Granted Dec 28, 2010·2 cites·15 claims
- 0368US7695345B2Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit deviceASAHI GLASS CO LTD·Filed 2007·Granted Apr 13, 2010·3 cites·21 claims
- 0459US8030213B2Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit deviceASAHI GLASS CO LTD·Filed 2007·Granted Oct 4, 2011·1 cites·21 claims
- 0553US7854777B2Polishing compound, method for production thereof, and polishing methodASAHI GLASS CO LTD·Filed 2004·Granted Dec 21, 2010·5 cites·3 claims
- 0652US2010055909A1Semiconductor polishing compound, process for its production and polishing methodASAHI GLASS CO LTD·Filed 2009·Application pending·0 cites
- 0747US11411962B2Information processing apparatus, access control method, and non-transitory computer readable mediumNEC CORP·Filed 2020·Granted Aug 9, 2022·0 cites·10 claims
- 0846US6630213B2Recording medium excellent in ink absorptivity and process for its production, and process for producing silica-alumina composite solASAHI GLASS CO LTD·Filed 2000·Granted Oct 7, 2003·1 cites·10 claims
- 0945US2009176373A1Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit deviceASAHI GLASS CO LTD·Filed 2009·Application pending·0 cites
- 1045US2009181539A1Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit deviceASAHI GLASS CO LTD·Filed 2009·Application pending·0 cites
- 1143US2005126080A1Semiconductor polishing compound, process for its production and polishing methodSEIMI CHEM KK·Filed 2005·Application pending·0 cites
- 1243US2008086950A1Semiconductor polishing compoundASAHI GLASS CO LTD·Filed 2007·Application pending·0 cites
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