Inventor · disambiguated record
Hisaho Inao
Also filed as: INAO HISAHO
3 granted patents·2 pending applications·12 citations·filing 2001–2010
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0159US7808096B2Semiconductor package and production method thereof, and semiconductor devicePANASONIC CORP·Filed 2005·Granted Oct 5, 2010·2 cites·6 claims
- 0259US6645792B2Lead frame and method for fabricating resin-encapsulated semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 11, 2003·10 cites·6 claims
- 0348US2008293190A1Semiconductor package, method for fabricating the same, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0445US7402898B2Semiconductor package, method for fabricating the same, and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 22, 2008·0 cites·4 claims
- 0542US2010320614A1Semiconductor package and production method thereof, and semiconductor devicePANASONIC CORP·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →