Inventor · disambiguated record
Christian Neugirg
Also filed as: NEUGIRG CHRISTIAN
10 granted patents·3 pending applications·22 citations·filing 2011–2022
84Inventor score
Top patents by PatentIndex Score
13 records- 0195US11037856B2Semiconductor chip package comprising a leadframe connected to a substrate and a semiconductor chip, and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 15, 2021·4 cites·20 claims
- 0282US9589922B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·5 cites·5 claims
- 0382US8998479B2Surface light guide and planar emitterBRICK PETER·Filed 2011·Granted Apr 7, 2015·6 cites·20 claims
- 0473US9488769B2Surface light guide and planar emitterBRICK PETER·Filed 2011·Granted Nov 8, 2016·3 cites·21 claims
- 0570US9176268B2Surface light sourceBRICK PETER·Filed 2011·Granted Nov 3, 2015·2 cites·12 claims
- 0669US11631628B2Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 0767US11574889B2Power module comprising two substrates and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 7, 2023·2 cites·12 claims
- 0856US12224222B2Semiconductor package having a thermally and electrically conductive spacerINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 11, 2025·0 cites·25 claims
- 0954US12183667B2Semiconductor package with power electronics carrier having trench spacing adapted for delaminationINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1053US2023411254A1Molded power semiconductor package with gate connector featureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1150US2019103342A1Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1247US11682611B2Power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 20, 2023·0 cites·22 claims
- 1347US2017154835A1Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
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