Inventor · disambiguated record
Keith Newman
Also filed as: NEWMAN KEITH · NEWMAN KEITH E · NEWMAN KEITH G
12 granted patents·4 pending applications·611 citations·filing 1988–2020
93Inventor score
Files withLSI LOGIC CORP5SUN MICROSYSTEMS INC3ADVANCED MICRO DEVICES INC1ECLIPSE MAGNETICS LTD1GLOBAL TUNGSTEN & POWDERS CORP1
Top patents by PatentIndex Score
16 records- 0195US5490324AMethod of making integrated circuit package having multiple bonding tiersLSI LOGIC CORP·Filed 1993·Granted Feb 13, 1996·233 cites·11 claims
- 0291US5227663AIntegral dam and heat sink for semiconductor device assemblyLSI LOGIC CORP·Filed 1992·Granted Jul 13, 1993·94 cites·8 claims
- 0388US7478741B1Solder interconnect integrity monitorSUN MICROSYSTEMS INC·Filed 2005·Granted Jan 20, 2009·14 cites·24 claims
- 0488US5455456AIntegrated circuit package lidLSI LOGIC CORP·Filed 1993·Granted Oct 3, 1995·105 cites·18 claims
- 0588US4919744AMethod of making a flexible heater comprising a conductive polymerRAYCHEM CORP·Filed 1988·Granted Apr 24, 1990·39 cites·14 claims
- 0676US5409863AMethod and apparatus for controlling adhesive spreading when attaching an integrated circuit dieLSI LOGIC CORP·Filed 1993·Granted Apr 25, 1995·53 cites·4 claims
- 0772US5357672AMethod and system for fabricating IC packages from laminated boards and heat spreaderLSI LOGIC CORP·Filed 1993·Granted Oct 25, 1994·47 cites·9 claims
- 0871US6371355B1Method and apparatus for solder joint integrity assessmentSUN MICROSYSTEMS INC·Filed 2000·Granted Apr 16, 2002·9 cites·7 claims
- 0966US7604748B2Magnetic filterECLIPSE MAGNETICS LTD·Filed 2005·Granted Oct 20, 2009·6 cites·28 claims
- 1064US7036387B2Integrated strain gages for board strain characterizationSUN MICROSYSTEMS INC·Filed 2004·Granted May 2, 2006·10 cites·24 claims
- 1157US8834721B2Magnetic filtration apparatusMARTIN KEVIN·Filed 2011·Granted Sep 16, 2014·1 cites·25 claims
- 1254US11111563B2High strength and erosion resistant powder blendsGLOBAL TUNGSTEN & POWDERS CORP·Filed 2018·Granted Sep 7, 2021·0 cites·18 claims
- 1346US2021239621A1Solderability, oxidation, and corrosion indicator for semiconductor packagesADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
- 1440US2003039572A1Method of producing powder metal parts using induction sinteringFiled 2001·Application pending·0 cites
- 1539US2006032258A1Cooling assemblyPRUITT ROGER·Filed 2005·Application pending·0 cites
- 1638US2003047032A1Method of producing powder metal parts from metallurgical powders including sponge ironFiled 2001·Application pending·0 cites
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