Inventor · disambiguated record
Daemian Raj
Also filed as: RAJ DAEMIAN · RAJ DAEMIAN RAJ BENJAMIN
11 granted patents·9 pending applications·110 citations·filing 2005–2025
89Inventor score
Top patents by PatentIndex Score
20 records- 0197US7572337B2Blocker plate bypass to distribute gases in a chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2005·Granted Aug 11, 2009·43 cites·15 claims
- 0294US7829145B2Methods of uniformity control for low flow process and chamber to chamber matchingAPPLIED MATERIALS INC·Filed 2008·Granted Nov 9, 2010·18 cites·16 claims
- 0394US7622005B2Uniformity control for low flow process and chamber to chamber matchingAPPLIED MATERIALS INC·Filed 2005·Granted Nov 24, 2009·19 cites·8 claims
- 0492US10428426B2Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetimeAPPLIED MATERIALS INC·Filed 2017·Granted Oct 1, 2019·9 cites·20 claims
- 0590US7189658B2Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profileAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·11 cites·20 claims
- 0688US9506145B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2016·Granted Nov 29, 2016·3 cites·20 claims
- 0788US9364871B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2013·Granted Jun 14, 2016·4 cites·11 claims
- 0879US7273823B2Situ oxide cap layer developmentAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·3 cites·20 claims
- 0961US2025259829A1Component, system, and method for improved foreline cleaningAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1057US2025357094A1Chamber with enhancement liner and methods for downstream residue managementAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1155US10934620B2Integration of dual remote plasmas sources for flowable CVDAPPLIED MATERIALS INC·Filed 2017·Granted Mar 2, 2021·0 cites·15 claims
- 1255US2025140537A1Chamber and methods for downstream residue managementAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1351US11367594B2Multizone flow gasbox for processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Jun 21, 2022·0 cites·11 claims
- 1447US2006054183A1Method to reduce plasma damage during cleaning of semiconductor wafer processing chamberNOWAK THOMAS·Filed 2005·Application pending·0 cites
- 1543US2014261703A1Method to detect valve deviationAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1642US2016017263A1Wet cleaning of a chamber componentAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1741US2015211114A1Bottom pump and purge and bottom ozone clean hardware to reduce fall-on particle defectsAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1838US8349746B2Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structureAPPLIED MATERIALS INC·Filed 2010·Granted Jan 8, 2013·0 cites·8 claims
- 1938US2018258531A1Diffuser design for flowable cvdAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2037US2018230597A1Method and apparatus of remote plasmas flowable cvd chamberAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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