Inventor · disambiguated record
Alexandros T. Demos
Also filed as: DEMOS ALEXANDROS · DEMOS ALEXANDROS T
75 granted patents·46 pending applications·3,349 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
121 records- 0198US8911553B2Quartz showerhead for nanocure UV chamberBALUJA SANJEEV·Filed 2011·Granted Dec 16, 2014·479 cites·9 claims
- 0298US7036453B2Apparatus for reducing plasma charge damage for plasma processesAPPLIED MATERIALS INC·Filed 2003·Granted May 2, 2006·467 cites·14 claims
- 0398US7018941B2Post treatment of low k dielectric filmsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 28, 2006·674 cites·20 claims
- 0498US6660662B2Method of reducing plasma charge damage for plasma processesAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·478 cites·15 claims
- 0597US8492170B2UV assisted silylation for recovery and pore sealing of damaged low K filmsXIE BO·Filed 2011·Granted Jul 23, 2013·522 cites·20 claims
- 0697US7256139B2Methods and apparatus for e-beam treatment used to fabricate integrated circuit devicesAPPLIED MATERIALS INC·Filed 2005·Granted Aug 14, 2007·46 cites·19 claims
- 0797US6936551B2Methods and apparatus for E-beam treatment used to fabricate integrated circuit devicesAPPLIED MATERIALS INC·Filed 2003·Granted Aug 30, 2005·52 cites·36 claims
- 0896US7879683B2Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delayAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·35 cites·17 claims
- 0994US10236197B2Processing system containing an isolation region separating a deposition chamber from a treatment chamberAPPLIED MATERIALS INC·Filed 2015·Granted Mar 19, 2019·11 cites·20 claims
- 1094US7297376B1Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layersAPPLIED MATERIALS INC·Filed 2006·Granted Nov 20, 2007·33 cites·26 claims
- 1193US11764101B2Susceptor for semiconductor substrate processingASM IP HOLDING BV·Filed 2020·Granted Sep 19, 2023·4 cites·45 claims
- 1293US6831284B2Large area source for uniform electron beam generationAPPLIED MATERIALS INC·Filed 2002·Granted Dec 14, 2004·59 cites·47 claims
- 1392US7425716B2Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beamAPPLIED MATERIALS INC·Filed 2006·Granted Sep 16, 2008·14 cites·27 claims
- 1492US6890403B2Apparatus and process for controlling the temperature of a substrate in a plasma reactorAPPLIED MATERIALS INC·Filed 2002·Granted May 10, 2005·82 cites·18 claims
- 1591US9646876B2Aluminum nitride barrier layerAPPLIED MATERIALS INC·Filed 2015·Granted May 9, 2017·9 cites·10 claims
- 1691US8993444B2Method to reduce dielectric constant of a porous low-k filmAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·5 cites·20 claims
- 1791US8657961B2Method for UV based silylation chamber cleanAPPLIED MATERIALS INC·Filed 2013·Granted Feb 25, 2014·8 cites·16 claims
- 1891US8455849B2Method and apparatus for modulating wafer treatment profile in UV chamberBALUJA SANJEEV·Filed 2011·Granted Jun 4, 2013·13 cites·18 claims
- 1989US11053591B2Multi-port gas injection system and reactor system including sameASM IP HOLDING BV·Filed 2018·Granted Jul 6, 2021·4 cites·22 claims
- 2089US6592980B1Mesoporous films having reduced dielectric constantsAIR PROD & CHEM·Filed 2000·Granted Jul 15, 2003·39 cites·6 claims
- 2189US6461980B1Apparatus and process for controlling the temperature of a substrate in a plasma reactor chamberAPPLIED MATERIALS INC·Filed 2000·Granted Oct 8, 2002·56 cites·19 claims
- 2288US9506145B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2016·Granted Nov 29, 2016·3 cites·20 claims
- 2388US9364871B2Method and hardware for cleaning UV chambersAPPLIED MATERIALS INC·Filed 2013·Granted Jun 14, 2016·4 cites·11 claims
- 2488US8877659B2Low-k dielectric damage repair by vapor-phase chemical exposureCHAN KELVIN·Filed 2013·Granted Nov 4, 2014·7 cites·12 claims
- 2588US8216861B1Dielectric recovery of plasma damaged low-k films by UV-assisted photochemical depositionYIM KANG SUB·Filed 2011·Granted Jul 10, 2012·14 cites·10 claims
- 2687US8753449B2Enhancement in UV curing efficiency using oxygen-doped purge for ultra low-K dielectric filmAPPLIED MATERIALS INC·Filed 2013·Granted Jun 17, 2014·9 cites·17 claims
- 2786US9123532B2Low-k dielectric damage repair by vapor-phase chemical exposureAPPLIED MATERIALS INC·Filed 2014·Granted Sep 1, 2015·5 cites·20 claims
- 2886US7670924B2Air gap integration schemeAPPLIED MATERIALS INC·Filed 2008·Granted Mar 2, 2010·22 cites·18 claims
- 2986US7410916B2Method of improving initiation layer for low-k dielectric film by digital liquid flow meterAPPLIED MATERIALS INC·Filed 2006·Granted Aug 12, 2008·9 cites·18 claims
- 3085US8389376B2Air gap integration schemeDEMOS ALEXANDROS T·Filed 2010·Granted Mar 5, 2013·4 cites·20 claims
- 3185US7615482B2Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strengthIBM·Filed 2007·Granted Nov 10, 2009·6 cites·21 claims
- 3285US6576568B2Ionic additives for extreme low dielectric constant chemical formulationsAPPLIED MATERIALS INC·Filed 2001·Granted Jun 10, 2003·29 cites·15 claims
- 3384US8481422B2Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layerCHAN KELVIN·Filed 2012·Granted Jul 9, 2013·6 cites·16 claims
- 3484US7989033B2Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 2008·Granted Aug 2, 2011·5 cites·6 claims
- 3583US12428726B2Gas injection system and reactor system including sameASM IP HOLDING BV·Filed 2020·Granted Sep 30, 2025·2 cites·12 claims
- 3682US9502263B2UV assisted CVD AlN film for BEOL etch stop applicationAPPLIED MATERIALS INC·Filed 2015·Granted Nov 22, 2016·3 cites·17 claims
- 3782US9058980B1UV-assisted photochemical vapor deposition for damaged low K films pore sealingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 16, 2015·5 cites·18 claims
- 3882US7998536B2Silicon precursors to make ultra low-K films of K<2.2 with high mechanical properties by plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 2007·Granted Aug 16, 2011·4 cites·13 claims
- 3982US7611996B2Multi-stage curing of low K nano-porous filmsAPPLIED MATERIALS INC·Filed 2005·Granted Nov 3, 2009·10 cites·7 claims
- 4082US7547643B2Techniques promoting adhesion of porous low K film to underlying barrier layerAPPLIED MATERIALS INC·Filed 2005·Granted Jun 16, 2009·6 cites·17 claims
- 4181US10797133B2Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structuresASM IP HOLDING BV·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
- 4280US7777197B2Vacuum reaction chamber with x-lamp heaterAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·7 cites·20 claims
- 4379US12006572B2Reactor system including a gas distribution assembly for use with activated species and method of using sameASM IP HOLDING BV·Filed 2020·Granted Jun 11, 2024·1 cites·25 claims
- 4479US9659765B2Enhancement of modulus and hardness for UV-cured ultra low-k dielectric filmsAPPLIED MATERIALS INC·Filed 2015·Granted May 23, 2017·3 cites·15 claims
- 4577US6818289B2Mesoporous films having reduced dielectric constantsAIR PROD & CHEM·Filed 2002·Granted Nov 16, 2004·17 cites·11 claims
- 4676US9850574B2Forming a low-k dielectric layer with reduced dielectric constant and strengthened mechanical propertiesAPPLIED MATERIALS INC·Filed 2015·Granted Dec 26, 2017·2 cites·18 claims
- 4776US9580801B2Enhancing electrical property and UV compatibility of ultrathin blok barrier filmAPPLIED MATERIALS INC·Filed 2014·Granted Feb 28, 2017·3 cites·19 claims
- 4875US6896955B2Ionic additives for extreme low dielectric constant chemical formulationsAPPLIED MATERIALS INC·Filed 2002·Granted May 24, 2005·16 cites·20 claims
- 4974US11482533B2Apparatus and methods for plug fill deposition in 3-D NAND applicationsASM IP HOLDING BV·Filed 2020·Granted Oct 25, 2022·1 cites·19 claims
- 5074US9391024B2Multi-layer dielectric stack for plasma damage protectionAPPLIED MATERIALS INC·Filed 2015·Granted Jul 12, 2016·2 cites·20 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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