Inventor · disambiguated record
Yoshifumi Katayama
Also filed as: KATAYAMA YOSHIFUMI
17 granted patents·1 pending application·392 citations·filing 1979–2015
95Inventor score
Top patents by PatentIndex Score
18 records- 0194US4337443ASemiconductor laser device with facet passivation filmHITACHI LTD·Filed 1980·Granted Jun 29, 1982·53 cites·9 claims
- 0293US4289822ALight-sensitive filmHITACHI LTD·Filed 1979·Granted Sep 15, 1981·68 cites·26 claims
- 0386US6722840B2Wafer ring supplying and returning apparatusSHINKAWA KK·Filed 2002·Granted Apr 20, 2004·38 cites·1 claims
- 0486US4433202AThin film solar cellHITACHI LTD·Filed 1982·Granted Feb 21, 1984·46 cites·12 claims
- 0574US4613382AMethod of forming passivated polycrystalline semiconductorsHITACHI LTD·Filed 1985·Granted Sep 23, 1986·43 cites·16 claims
- 0668US6279226B1Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chipHITACHI LTD·Filed 1998·Granted Aug 28, 2001·32 cites·3 claims
- 0768US4673959AHeterojunction FET with doubly-doped channelHITACHI LTD·Filed 1984·Granted Jun 16, 1987·20 cites·15 claims
- 0867US4351856ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1980·Granted Sep 28, 1982·27 cites·8 claims
- 0961US9887117B2Electrostatic chuck and semiconductor-liquid crystal manufacturing apparatusSHINKO ELECTRIC IND CO·Filed 2015·Granted Feb 6, 2018·1 cites·6 claims
- 1060US4605945ASemiconductor deviceHITACHI LTD·Filed 1984·Granted Aug 12, 1986·15 cites·22 claims
- 1155US6898848B2Method of bonding inner leads to chip padsRENESAS TECH CORP·Filed 2002·Granted May 31, 2005·6 cites·1 claims
- 1253US4796068ASemiconductor device having ultrahigh-mobilityHITACHI LTD·Filed 1987·Granted Jan 3, 1989·14 cites·31 claims
- 1350US4559547ASemiconductor deviceHITACHI LTD·Filed 1982·Granted Dec 17, 1985·10 cites·21 claims
- 1447US2010078125A1Method for securing a curved circuit board in die bonder and recording medium containing program for securing a curved circuit board in die bonderSHINKAWA KK·Filed 2008·Application pending·0 cites
- 1545US6516515B2Semiconductor integrated circuitHITACHI LTD·Filed 2001·Granted Feb 11, 2003·2 cites·4 claims
- 1643US4759030ASemiconductor laserHITACHI LTD·Filed 1986·Granted Jul 19, 1988·6 cites·6 claims
- 1738US4835583ASemiconductor device having strained superlattice buffer layers with In-doped GaAs substrateHITACHI LTD·Filed 1986·Granted May 30, 1989·8 cites·14 claims
- 1834US4672406ASemiconductor member and semiconductor device employing the sameHITACHI LTD·Filed 1984·Granted Jun 9, 1987·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →