Inventor · disambiguated record
Sun-Kyoung Seo
Also filed as: SEO SUN KYOUNG
20 granted patents·2 pending applications·193 citations·filing 2011–2024
94Inventor score
Top patents by PatentIndex Score
22 records- 0196US10083939B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 25, 2018·12 cites·20 claims
- 0296US9666551B1Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 30, 2017·17 cites·20 claims
- 0396US9543276B2Chip-stacked semiconductor packageJEE YOUNG-KUN·Filed 2015·Granted Jan 10, 2017·55 cites·13 claims
- 0494US9449930B2Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the sameKIM TAE-HYEONG·Filed 2015·Granted Sep 20, 2016·47 cites·17 claims
- 0593US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 0693US9831202B2Semiconductor devices with solder-based connection terminals and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·11 cites·14 claims
- 0790US8698317B2Methods of fabricating package stack structure and method of mounting package stack structure on system boardSEO SUN-KYOUNG·Filed 2011·Granted Apr 15, 2014·16 cites·20 claims
- 0889US10658341B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 19, 2020·3 cites·20 claims
- 0985US10134702B2Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·4 cites·17 claims
- 1084US12040337B2Semiconductor package with protective moldSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 1183US10373935B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 6, 2019·2 cites·20 claims
- 1282US10867970B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 15, 2020·1 cites·17 claims
- 1378US12433050B2Semiconductor package with protective moldSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 1476US9376541B2Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 1575US8742577B2Semiconductor package having an anti-contact layerJEE YOUNG-KUN·Filed 2012·Granted Jun 3, 2014·4 cites·19 claims
- 1674US11610865B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 1771US10991677B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·20 claims
- 1871US9893018B2Alignment mark for semiconductor deviceKO YEONG KWON·Filed 2015·Granted Feb 13, 2018·3 cites·18 claims
- 1962US8735221B2Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the methodYOO JAE-WOOK·Filed 2011·Granted May 27, 2014·1 cites·19 claims
- 2059US2024162181A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US9136255B2Methods of fabricating package stack structure and method of mounting package stack structure on system boardSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 15, 2015·0 cites·20 claims
- 2252US2014232005A1Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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