Inventor · disambiguated record
Tae-Je Cho
Also filed as: CHO TAE-JE
64 granted patents·17 pending applications·1,203 citations·filing 1997–2019
99Inventor score
Top patents by PatentIndex Score
81 records- 0197US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0297US7327038B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·69 cites·24 claims
- 0396US9666551B1Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 30, 2017·17 cites·20 claims
- 0496US8816407B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·90 cites·20 claims
- 0595US9589945B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 7, 2017·15 cites·16 claims
- 0695US6849949B1Thin stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 1, 2005·108 cites·26 claims
- 0794US9853012B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·12 cites·9 claims
- 0894US9449930B2Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the sameKIM TAE-HYEONG·Filed 2015·Granted Sep 20, 2016·47 cites·17 claims
- 0994US6087722AMulti-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 11, 2000·260 cites·11 claims
- 1093US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 1193US9831202B2Semiconductor devices with solder-based connection terminals and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 28, 2017·11 cites·14 claims
- 1293US8803334B2Semiconductor package including a semiconductor chip with a through silicon viaCHOI YUN-SEOK·Filed 2012·Granted Aug 12, 2014·16 cites·20 claims
- 1393US6878570B2Thin stacked package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 12, 2005·83 cites·12 claims
- 1492US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 1592US8187921B2Semiconductor package having ink-jet type dam and method of manufacturing the sameYIM CHOONG-BIN·Filed 2011·Granted May 29, 2012·14 cites·14 claims
- 1691US9515057B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 6, 2016·13 cites·18 claims
- 1791US9412707B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·8 cites·19 claims
- 1891US9165916B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 20, 2015·14 cites·13 claims
- 1990US5897339ALead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 27, 1999·122 cites·10 claims
- 2089US10903170B2Substrate having embedded interconnect structureSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 26, 2021·6 cites·31 claims
- 2189US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 2289US9287140B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 15, 2016·9 cites·19 claims
- 2389US9070729B2Wafer processing method and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 30, 2015·21 cites·20 claims
- 2489US8643179B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageIM YUN-HYEOK·Filed 2011·Granted Feb 4, 2014·11 cites·22 claims
- 2587US9601465B2Chip-stacked semiconductor package and method of manufacturing the sameKANG UN-BYOUNG·Filed 2014·Granted Mar 21, 2017·8 cites·14 claims
- 2687US7999368B2Semiconductor package having ink-jet type dam and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 16, 2011·12 cites·10 claims
- 2785US10134702B2Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 20, 2018·4 cites·17 claims
- 2885US9899337B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 20, 2018·5 cites·12 claims
- 2984US10497675B2Semiconductor device including multiple semiconductor chipsKWAK BYOUNG SOO·Filed 2016·Granted Dec 3, 2019·7 cites·14 claims
- 3084US8587134B2Semiconductor packagesIM YUN-HYEOK·Filed 2012·Granted Nov 19, 2013·8 cites·20 claims
- 3182US11043441B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 22, 2021·3 cites·28 claims
- 3281US9875918B2Initiator and method for debonding wafer supporting systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 23, 2018·3 cites·19 claims
- 3381US6952050B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 4, 2005·27 cites·6 claims
- 3480US9076881B2Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 7, 2015·4 cites·13 claims
- 3579US10535534B2Method of fabricating an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·19 claims
- 3679US9478514B2Pre-package and methods of manufacturing semiconductor package and electronic device using the sameCHANG GUN-HO·Filed 2015·Granted Oct 25, 2016·4 cites·20 claims
- 3779US7330084B2Printed circuit board having a bond wire shield structure for a signal transmission lineSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·9 cites·32 claims
- 3877US6518660B2Semiconductor package with ground projectionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·25 cites·15 claims
- 3976US9761477B2Pre-package and methods of manufacturing semiconductor package and electronic device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 12, 2017·2 cites·20 claims
- 4076US9376541B2Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 4176US8902356B2Image sensor module having image sensor packageSEO BYOUNG-RIM·Filed 2011·Granted Dec 2, 2014·7 cites·17 claims
- 4276US8847378B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 30, 2014·3 cites·20 claims
- 4374US9171825B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·3 cites·22 claims
- 4473US11018026B2Interposer, semiconductor package, and method of fabricating interposerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·1 cites·17 claims
- 4573US9324683B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·3 cites·12 claims
- 4673US7078800B2Semiconductor packageSAMSUNG ELELCTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·19 cites·7 claims
- 4772US8980689B2Method of fabricating semiconductor multi-chip stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·3 cites·20 claims
- 4871US9893018B2Alignment mark for semiconductor deviceKO YEONG KWON·Filed 2015·Granted Feb 13, 2018·3 cites·18 claims
- 4970US9929022B2Semiconductor chip package and method of manufacturing the sameLEE SEOK HYUN·Filed 2016·Granted Mar 27, 2018·2 cites·20 claims
- 5069US9482584B2System and method for predicting the temperature of a deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 1, 2016·2 cites·13 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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