Inventor · disambiguated record
Cheng-Pu Chiu
Also filed as: CHIU CHENG-PU
20 granted patents·7 pending applications·63 citations·filing 2008–2025
92Inventor score
Files withUNITED MICROELECTRONICS CORP17FAN SHIH-KANG5TAIWAN SEMICONDUCTOR MFG CO LTD2CHUNGHWA PICTURE TUBES LTD1CHUNGWA PICTURE TUBES LTD1
Top patents by PatentIndex Score
27 records- 0196US10109531B1Semiconductor structure having a bump lower than a substrate base and a width of the bump larger than a width of fin shaped structures, and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 23, 2018·31 cites·20 claims
- 0293US10283415B2Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 7, 2019·8 cites·20 claims
- 0389US11289572B1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Mar 29, 2022·2 cites·8 claims
- 0489US10373861B1FinFET with curved STIUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·7 cites·11 claims
- 0582US10062584B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·3 cites·19 claims
- 0682US8232961B2Pixel driving structure of displaying three colors of particle display and its displaying colors methodFAN SHIH-KANG·Filed 2009·Granted Jul 31, 2012·6 cites·16 claims
- 0780US2025040198A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0879US12148796B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 19, 2024·0 cites·8 claims
- 0972US11764261B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 19, 2023·0 cites·17 claims
- 1072US2025266380A1Heat dissipating features for laser drilling processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1171US8400593B2Electro-optical deviceFAN SHIH-KANG·Filed 2010·Granted Mar 19, 2013·2 cites·12 claims
- 1270US12322716B2Heat dissipating features for laser drilling processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1370US10622245B2FinFET with curved STIUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 14, 2020·1 cites·7 claims
- 1469US10217866B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 26, 2019·1 cites·11 claims
- 1565US7724419B1DisplayCHUNGWA PICTURE TUBES LTD·Filed 2009·Granted May 25, 2010·2 cites·16 claims
- 1664US11569235B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 31, 2023·0 cites·9 claims
- 1757US10868011B2Semiconductor device and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 15, 2020·0 cites·9 claims
- 1857US10446682B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 15, 2019·0 cites·8 claims
- 1949US10686079B1Fin field effect transistor structure with particular gate appearanceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 16, 2020·0 cites·14 claims
- 2046US2010079424A1Display medium and displayCHUNGHWA PICTURE TUBES LTD·Filed 2009·Application pending·0 cites
- 2145US8390564B2DisplayFAN SHIH-KANG·Filed 2008·Granted Mar 5, 2013·0 cites·16 claims
- 2245US2010230044A1Bubbleless packaging methodFAN SHIH-KANG·Filed 2009·Application pending·0 cites
- 2343US10211107B1Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean stepUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 19, 2019·0 cites·6 claims
- 2440US8451301B2Color display deviceFAN SHIH-KANG·Filed 2010·Granted May 28, 2013·0 cites·17 claims
- 2540US2020194058A1Layout pattern for sram and manufacturing methods thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2639US2011195258A1Microencapsulated liquid device and method for making the sameUNIV NAT CHIAO TUNG·Filed 2010·Application pending·0 cites
- 2737US2019103492A1Method for fabricating semiconductor device involving forming epitaxial materialUNITED MICROELECTRONICS CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →