Inventor · disambiguated record
Michiaki Sugiyama
Also filed as: SUGIYAMA MICHIAKI
53 granted patents·11 pending applications·1,519 citations·filing 1998–2019
99Inventor score
Files withRENESAS TECH CORP18RENESAS ELECTRONICS CORP16HITACHI LTD13HITACHI ULSI SYS CO LTD3KONNO JUMPEI2
Top patents by PatentIndex Score
64 records- 0198US7296754B2IC card moduleRENESAS TECH CORP·Filed 2005·Granted Nov 20, 2007·106 cites·38 claims
- 0298US6555918B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2002·Granted Apr 29, 2003·188 cites·9 claims
- 0397US7291903B2Memory cardRENESAS TECH CORP·Filed 2005·Granted Nov 6, 2007·44 cites·27 claims
- 0496US6479322B2Semiconductor device with two stacked chips in one resin body and method of producingHITACHI LTD·Filed 2002·Granted Nov 12, 2002·158 cites·1 claims
- 0595US8319352B2Semiconductor deviceSHINOHARA MINORU·Filed 2011·Granted Nov 27, 2012·23 cites·2 claims
- 0695USD552098SMemory cardSONY KABUSHIKI KAISHA·Filed 2005·Granted Oct 2, 2007·70 cites·1 claims
- 0795USD552099SMemory cardSONY KABUSHIKI KAISHA·Filed 2005·Granted Oct 2, 2007·73 cites·1 claims
- 0894US6551858B2Method of producing a semiconductor device having two semiconductor chips sealed by a resinHITACHI LTD·Filed 2002·Granted Apr 22, 2003·97 cites·9 claims
- 0993US7352588B2Semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 1, 2008·26 cites·14 claims
- 1092US7669773B2IC card moduleRENESAS TECH CORP·Filed 2007·Granted Mar 2, 2010·22 cites·21 claims
- 1192US6853089B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 8, 2005·83 cites·29 claims
- 1292US6252299B1Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 1998·Granted Jun 26, 2001·98 cites·7 claims
- 1390USD581932SMemory cardRENESAS TECH CORP·Filed 2007·Granted Dec 2, 2008·38 cites·1 claims
- 1489US7989960B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 2, 2011·13 cites·17 claims
- 1589USD556764SMemory cardRENESAS TECH CORP·Filed 2007·Granted Dec 4, 2007·34 cites·1 claims
- 1685US8222738B2Semiconductor device, and manufacturing method thereforOTA YUSUKE·Filed 2011·Granted Jul 17, 2012·8 cites·3 claims
- 1785US7341198B2IC card and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Mar 11, 2008·41 cites·17 claims
- 1885US7325746B2Memory card and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 5, 2008·35 cites·7 claims
- 1983US7946500B2Memory card and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted May 24, 2011·10 cites·8 claims
- 2083US6410987B1Semiconductor device and a method of manufacturing the same and an electronic deviceHITACHI LTD·Filed 1999·Granted Jun 25, 2002·65 cites·12 claims
- 2182US9377825B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 28, 2016·4 cites·15 claims
- 2280US6383845B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2001·Granted May 7, 2002·20 cites·8 claims
- 2378US9355869B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted May 31, 2016·4 cites·12 claims
- 2478US6750080B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·24 cites·9 claims
- 2577US7971793B2Memory cardRENESAS ELECTRONICS CORP·Filed 2007·Granted Jul 5, 2011·6 cites·12 claims
- 2676US8138022B2Method of manufacturing semiconductor deviceSUGIYAMA MICHIAKI·Filed 2010·Granted Mar 20, 2012·6 cites·14 claims
- 2776US7227251B2Semiconductor device and a memory system including a plurality of IC chips in a common packageELPIDA MEMORY INC·Filed 2005·Granted Jun 5, 2007·6 cites·10 claims
- 2875US9455240B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 27, 2016·4 cites·13 claims
- 2974US7214622B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted May 8, 2007·9 cites·9 claims
- 3071US7971791B2Multi-function card deviceRENESAS ELECTRONICS CORP·Filed 2003·Granted Jul 5, 2011·15 cites·8 claims
- 3171US7308588B2Memory cardRENESAS TECH CORP·Filed 2004·Granted Dec 11, 2007·15 cites·13 claims
- 3270US6097081ASemiconductor device having adhesive between lead and chipHITACHI LTD·Filed 1998·Granted Aug 1, 2000·37 cites·36 claims
- 3367US6410365B1Semiconductor device with two stacked chips in one resin body and method of producingHITACHI LTD·Filed 1999·Granted Jun 25, 2002·27 cites·4 claims
- 3465US8534532B2Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Granted Sep 17, 2013·2 cites·17 claims
- 3565US7804176B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted Sep 28, 2010·4 cites·8 claims
- 3664US6501183B2Semiconductor device and a method of manufacturing the same and an electronic deviceHITACHI LTD·Filed 2001·Granted Dec 31, 2002·11 cites·8 claims
- 3763US8021932B2Semiconductor device, and manufacturing method thereforRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 20, 2011·2 cites·9 claims
- 3863USD552612SMemory cardRENESAS TECH CORP·Filed 2005·Granted Oct 9, 2007·13 cites·1 claims
- 3962US6885092B1Semiconductor device and a memory system including a plurality of IC chips in a common packageHITACHI ULSI SYS CO LTD·Filed 1999·Granted Apr 26, 2005·24 cites·4 claims
- 4060US6297545B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·7 cites·8 claims
- 4160US6153922ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 28, 2000·19 cites·13 claims
- 4259US7399694B2Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·2 cites·11 claims
- 4356US8084869B2Semiconductor device and method for manufacturing the sameMIWA TAKASHI·Filed 2009·Granted Dec 27, 2011·1 cites·27 claims
- 4456US6285074B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Sep 4, 2001·5 cites·9 claims
- 4555US9818678B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 14, 2017·0 cites·19 claims
- 4655US6552437B1Semiconductor device and method of manufacture thereofHITACHI LTD·Filed 1999·Granted Apr 22, 2003·18 cites·28 claims
- 4754US8754534B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jun 17, 2014·0 cites·1 claims
- 4852US2008025003A1Memory cardNISHIZAWA HIROTAKA·Filed 2007·Application pending·0 cites
- 4950US2008153205A1Semiconductor device and a method for manufacturing the sameNISHIZAWA HIROTAKA·Filed 2008·Application pending·0 cites
- 5049US11049786B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Jun 29, 2021·0 cites·15 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →