Inventor · disambiguated record
Sivakami Ramanathan
Also filed as: RAMANATHAN SIVAKAMI
11 granted patents·8 pending applications·200 citations·filing 2002–2015
91Inventor score
Top patents by PatentIndex Score
19 records- 0193US6821909B2Post rinse to improve selective deposition of electroless cobalt on copper for ULSI applicationAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·62 cites·22 claims
- 0287US6824666B2Electroless deposition method over sub-micron aperturesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 30, 2004·42 cites·102 claims
- 0384US9123651B2Dense oxide coated component of a plasma processing chamber and method of manufacture thereofLAM RES CORP·Filed 2013·Granted Sep 1, 2015·6 cites·12 claims
- 0484US6905622B2Electroless deposition methodAPPLIED MATERIALS INC·Filed 2002·Granted Jun 14, 2005·32 cites·45 claims
- 0581US9546432B2Dense oxide coated component of a plasma processing chamber and method of manufacture thereofLAM RES CORP·Filed 2015·Granted Jan 17, 2017·3 cites·10 claims
- 0681US9337002B2Corrosion resistant aluminum coating on plasma chamber componentsLAM RES CORP·Filed 2013·Granted May 10, 2016·6 cites·21 claims
- 0780US6899816B2Electroless deposition methodAPPLIED MATERIALS INC·Filed 2002·Granted May 31, 2005·24 cites·35 claims
- 0879US6878245B2Method and apparatus for reducing organic depletion during non-processing time periodsAPPLIED MATERIALS INC·Filed 2002·Granted Apr 12, 2005·12 cites·17 claims
- 0965US6797620B2Method and apparatus for improved electroplating fill of an apertureAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·12 cites·35 claims
- 1064US8545639B2Method of cleaning aluminum plasma chamber partsSHIH HONG·Filed 2011·Granted Oct 1, 2013·1 cites·19 claims
- 1151US9387521B2Method of wet cleaning aluminum chamber partsLAM RES CORP·Filed 2013·Granted Jul 12, 2016·0 cites·20 claims
- 1244US2005136185A1Post rinse to improve selective deposition of electroless cobalt on copper for ULSI applicationFiled 2004·Application pending·0 cites
- 1343US2002112964A1Process window for gap-fill on very high aspect ratio structures using additives in low acid copper bathsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1443US2003159937A1Method to reduce the depletion of organics in electroplating bathsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1537US2003146102A1Method for forming copper interconnectsAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1637US2003188974A1Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnectsAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 1736US2003143837A1Method of depositing a catalytic layerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1836US2003209523A1Planarization by chemical polishing for ULSI applicationsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1933US2003190426A1Electroless deposition methodFiled 2002·Application pending·0 cites
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