Inventor · disambiguated record
Cheng Siew Tay
Also filed as: TAY CHENG SIEW
9 granted patents·93 citations·filing 2002–2011
86Inventor score
Top patents by PatentIndex Score
9 records- 0193US7642660B2Method and apparatus for reducing electrical interconnection fatigueTAY CHENG SIEW·Filed 2006·Granted Jan 5, 2010·71 cites·8 claims
- 0271US7242084B2Apparatuses and associated methods for improved solder joint reliabilityINTEL CORP·Filed 2005·Granted Jul 10, 2007·6 cites·19 claims
- 0360US8079011B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2007·Granted Dec 13, 2011·3 cites·18 claims
- 0459US7173342B2Method and apparatus for reducing electrical interconnection fatigueINTEL CORP·Filed 2002·Granted Feb 6, 2007·8 cites·8 claims
- 0558US7789285B2Solder printing process to reduce void formation in a microviaINTEL CORP·Filed 2007·Granted Sep 7, 2010·2 cites·10 claims
- 0649US8533657B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2011·Granted Sep 10, 2013·0 cites·11 claims
- 0748US7326859B2Printed circuit boards having pads for solder balls and methods for the implementation thereofINTEL CORP·Filed 2003·Granted Feb 5, 2008·3 cites·10 claims
- 0836US7331503B2Solder printing process to reduce void formation in a microviaINTEL CORP·Filed 2004·Granted Feb 19, 2008·0 cites·6 claims
- 0930US7400040B2Thermal interface apparatus, systems, and methodsINTEL CORP·Filed 2003·Granted Jul 15, 2008·0 cites·24 claims
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