Assignee
TAY CHENG SIEW
MY·3 granted patents·74 citations·filing 2006–2011
Top patents by PatentIndex Score
3 records- 0193US7642660B2Method and apparatus for reducing electrical interconnection fatigueTAY CHENG SIEW·Filed 2006·Granted Jan 5, 2010·71 cites·8 claims
- 0260US8079011B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2007·Granted Dec 13, 2011·3 cites·18 claims
- 0349US8533657B2Printed circuit boards having pads for solder balls and methods for the implementation thereofTAY CHENG SIEW·Filed 2011·Granted Sep 10, 2013·0 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when TAY CHENG SIEW files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →