Inventor · disambiguated record
Se-Yong Oh
Also filed as: OH SE-YONG
25 granted patents·8 pending applications·918 citations·filing 1997–2023
97Inventor score
Top patents by PatentIndex Score
33 records- 0199US7215033B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·422 cites·11 claims
- 0292US6959856B2Solder bump structure and method for forming a solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 1, 2005·67 cites·14 claims
- 0392USD432096SSemiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 17, 2000·48 cites·1 claims
- 0490USD432097SSemiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 17, 2000·42 cites·1 claims
- 0590US5897339ALead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 27, 1999·122 cites·10 claims
- 0686US6818998B2Stacked chip package having upper chip provided with trenches and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 16, 2004·38 cites·12 claims
- 0786US6812567B2Semiconductor package and package stack made thereofSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 2, 2004·42 cites·14 claims
- 0881US6952050B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 4, 2005·27 cites·6 claims
- 0978US7786594B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·5 cites·25 claims
- 1077US8278766B2Wafer level stack structure for system-in-package and method thereofLEE KANG-WOOK·Filed 2010·Granted Oct 2, 2012·3 cites·16 claims
- 1176US7855144B2Method of forming metal lines and bumps for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 21, 2010·7 cites·15 claims
- 1276US7115483B2Stacked chip package having upper chip provided with trenches and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Oct 3, 2006·19 cites·9 claims
- 1374US7253026B2Ultra-thin semiconductor package device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 7, 2007·5 cites·20 claims
- 1474US7214604B2Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 8, 2007·17 cites·14 claims
- 1573US7078800B2Semiconductor packageSAMSUNG ELELCTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·19 cites·7 claims
- 1671US7824959B2Wafer level stack structure for system-in-package and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·3 cites·13 claims
- 1770US7012325B2Ultra-thin semiconductor package device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 14, 2006·15 cites·63 claims
- 1867US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 1957US12032013B2Substrate inspection device and substrate inspection methodJUSUNG ENG CO LTD·Filed 2023·Granted Jul 9, 2024·0 cites·17 claims
- 2052US6432746B2Method for manufacturing a chip scale package having slits formed on a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 13, 2002·8 cites·20 claims
- 2151US6943438B2Memory card having a control chipSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 13, 2005·4 cites·8 claims
- 2249US6455654B1Water-soluble polymeric adhesion promoter and production methodSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 24, 2002·1 cites·10 claims
- 2348US2007200251A1Method of fabricating ultra thin flip-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2448US2017318882A1Method of manufacturing decorative flowerOH SE YONG·Filed 2016·Application pending·0 cites
- 2546US2007158843A1Semiconductor package having improved solder joint reliability and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2646US2005208751A1Solder bump structure and method for forming a solder bumpOH SE-YONG·Filed 2005·Application pending·0 cites
- 2745US2007096338A1Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2842US6531564B2Water-soluble polymeric adhesion promoter and production methodSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 11, 2003·0 cites·11 claims
- 2941US2005104222A1Flip chip device having supportable bar and mounting structure thereofFiled 2004·Application pending·0 cites
- 3040US11726134B2Substrate inspection device and substrate inspection methodJUSUNG ENG CO LTD·Filed 2018·Granted Aug 15, 2023·0 cites·18 claims
- 3140US7414303B2Lead on chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 19, 2008·0 cites·19 claims
- 3238US2005282315A1High-reliability solder joint for printed circuit board and semiconductor package module using the sameJEONG SE-YOUNG·Filed 2005·Application pending·0 cites
- 3336US2002119595A1Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →