Inventor · disambiguated record
William K. Shu
Also filed as: SHU WILLIAM K · SHU WILLIAM KUANG-HUA · SHU WILLIAM KUANG-HUE
9 granted patents·243 citations·filing 1990–2007
90Inventor score
Top patents by PatentIndex Score
9 records- 0186US7782629B2Embedding an electronic component between surfaces of a printed circuit boardFLEXTRONICS AP LLC·Filed 2007·Granted Aug 24, 2010·17 cites·19 claims
- 0283US5598031AElectrically and thermally enhanced package using a separate silicon substrateVLSI TECHNOLOGY INC·Filed 1994·Granted Jan 28, 1997·81 cites·40 claims
- 0371US5153507AMulti-purpose bond pad test dieVLSI TECHNOLOGY INC·Filed 1990·Granted Oct 6, 1992·48 cites·23 claims
- 0467US7867806B2Electronic component structure and method of makingFLEXTRONICS AP LLC·Filed 2007·Granted Jan 11, 2011·4 cites·11 claims
- 0556US6037669AStaggered pad arrayVLSI TECHNOLOGY INC·Filed 1996·Granted Mar 14, 2000·23 cites·21 claims
- 0656US5675179AUniversal test die and method for fine pad pitch designsVLSI TECHNOLOGY INC·Filed 1995·Granted Oct 7, 1997·23 cites·9 claims
- 0751US6020647AComposite metallization structures for improved post bonding reliabilityVLSI TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·19 cites·18 claims
- 0851US5525839AMethod of packing an IC die in a molded plastic employing an ultra-thin die coating processVLSI TECHNOLOGY INC·Filed 1994·Granted Jun 11, 1996·20 cites·4 claims
- 0939US6503820B1Die pad crack absorption system and method for integrated circuit chip fabricationKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Jan 7, 2003·8 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →