Inventor · disambiguated record
Katsuya Sakayori
Also filed as: SAKAYORI KATSUYA
30 granted patents·15 pending applications·155 citations·filing 2001–2024
96Inventor score
Top patents by PatentIndex Score
45 records- 0191US6942817B2Method of manufacturing wireless suspension blankDAINIPPON PRINTING CO LTD·Filed 2001·Granted Sep 13, 2005·60 cites·17 claims
- 0288US9024312B2Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistorFUKUDA SHUNJI·Filed 2010·Granted May 5, 2015·13 cites·28 claims
- 0386US8071273B2Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin compositionSAKAYORI KATSUYA·Filed 2009·Granted Dec 6, 2011·7 cites·6 claims
- 0480US8088882B2Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2006·Granted Jan 3, 2012·6 cites·12 claims
- 0580US7175736B2Laminate for electronic circuitDAINIPPON PRINTING CO LTD·Filed 2004·Granted Feb 13, 2007·12 cites·3 claims
- 0680US2024368361A1Polyimide film, method for producing polyimide film, and polyimide precursor resin compositionDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0779US8476444B2Base generatorKATAYAMA MAMI·Filed 2009·Granted Jul 2, 2013·8 cites·5 claims
- 0879US8211613B2Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the compositionSAKAYORI KATSUYA·Filed 2008·Granted Jul 3, 2012·4 cites·8 claims
- 0978US8778596B2Photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, and pattern forming method and article using the photosensitive resin compositionDAINIPPON PRINTING CO LTD·Filed 2013·Granted Jul 15, 2014·4 cites·11 claims
- 1072US9647242B2Heat-conductive sealing member and electroluminescent elementFUKUDA SHUNJI·Filed 2010·Granted May 9, 2017·3 cites·22 claims
- 1172US8697332B2Base generator, photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, pattern forming method using the photosensitive resin composition and products comprising the sameKATAYAMA MAMI·Filed 2010·Granted Apr 15, 2014·2 cites·10 claims
- 1269US8859186B2Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin compositionSAKAYORI KATSUYA·Filed 2011·Granted Oct 14, 2014·1 cites·16 claims
- 1368US7141354B2Photo radical generator, photo sensitive resin composition and articleDAINIPPON PRINTING CO LTD·Filed 2004·Granted Nov 28, 2006·3 cites·6 claims
- 1467US8252423B2Laminate and use thereofSAKAYORI KATSUYA·Filed 2010·Granted Aug 28, 2012·2 cites·1 claims
- 1567US7410746B2Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the compositionDAINIPPON PRINTING CO LTD·Filed 2003·Granted Aug 12, 2008·7 cites·13 claims
- 1667US7226806B2Wet etched insulator and electronic circuit componentDAINIPPON PRINTING CO LTD·Filed 2002·Granted Jun 5, 2007·10 cites·45 claims
- 1765US9332631B2Heat dissipating substrate, and element equipped with sameDAINIPPON PRINTING CO LTD·Filed 2013·Granted May 3, 2016·2 cites·9 claims
- 1864US2025052620A1Resin panel for infrared sensor, and infrared sensor and article employing said resin panelDAINIPPON PRINTING CO LTD·Filed 2023·Application pending·0 cites
- 1959US8742059B2Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2011·Granted Jun 3, 2014·0 cites·4 claims
- 2059US6709988B2Production process of electronic component using wet etching, electronic component, and suspension for hard diskDAINIPPON PRINTING CO LTD·Filed 2002·Granted Mar 23, 2004·9 cites·25 claims
- 2159US2017103777A1Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveDAINIPPON PRINTING CO LTD·Filed 2016·Application pending·0 cites
- 2258US7932340B2Photo radical generator, photo sensitive resin composition and articleDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 26, 2011·0 cites·13 claims
- 2358US2019092913A1Polyimide film, method for producing polyimide film, and polyimide precursor resin compositionDAINIPPON PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 2457US8927122B2Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveHITOMI YOICHI·Filed 2008·Granted Jan 6, 2015·0 cites·17 claims
- 2557US7951460B2Laminate for electronic circuitDAINIPPON PRINTING CO LTD·Filed 2004·Granted May 31, 2011·0 cites·6 claims
- 2653US9564153B2Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk driveDAINIPPON PRINTING CO LTD·Filed 2014·Granted Feb 7, 2017·0 cites·4 claims
- 2752US8066891B2Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the filmSAKAYORI KATSUYA·Filed 2006·Granted Nov 29, 2011·0 cites·17 claims
- 2851US2002086171A1Laminate for electronic circuitFiled 2001·Application pending·0 cites
- 2950US7528205B2Photo radical generator, photo sensitive resin composition and articleDAINIPPON PRINTING CO LTD·Filed 2004·Granted May 5, 2009·1 cites·11 claims
- 3050US2007120229A1Wet etched insulator and electronic circuit componentDAINIPPON PRINTING CO LTD·Filed 2007·Application pending·0 cites
- 3149US10400085B2Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production methodDAINIPPON PRINTING CO LTD·Filed 2014·Granted Sep 3, 2019·0 cites·19 claims
- 3249US2007100129A1Low expansion polyimide, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2006·Application pending·0 cites
- 3349US2006073316A1HDD suspension and its manufactureDAINIPPON PRINTING CO LTD·Filed 2005·Application pending·0 cites
- 3448US8308967B2Wet etched insulator and electronic circuit componentSAKAYORI KATSUYA·Filed 2011·Granted Nov 13, 2012·0 cites·5 claims
- 3546US11566108B2Polyimide film, laminate and surface material for displayDAINIPPON PRINTING CO LTD·Filed 2017·Granted Jan 31, 2023·0 cites·15 claims
- 3645US6750148B2Method of manufacturing wireless suspension blankDAINIPPON PRINTING CO LTD·Filed 2001·Granted Jun 15, 2004·1 cites·12 claims
- 3745US2005256295A1Polymer compound, highly transparent polyimide, resin composition and articleSAKAYORI KATSUYA·Filed 2005·Application pending·0 cites
- 3837US2013126860A1Thin film transistor substrateFUKUDA SHUNJI·Filed 2012·Application pending·0 cites
- 3936US10454008B2Resin composition, reflector, lead frame with reflector, and semiconductor light-emitting deviceDAINIPPON PRINTING CO LTD·Filed 2015·Granted Oct 22, 2019·0 cites·17 claims
- 4036US2015372205A1Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production methodDAINIPPON PRINTING CO LTD·Filed 2014·Application pending·0 cites
- 4134US2004096676A1Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the filmFiled 2002·Application pending·0 cites
- 4234US2012183751A1Base generator, photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, pattern forming method using the photosensitive resin composition and products comprising the sameKATAYAMA MAMI·Filed 2010·Application pending·0 cites
- 4334US2002155710A1HDD suspension and its manufactureFiled 2002·Application pending·0 cites
- 4432US10411174B2Semiconductor light-emitting device and optical-semiconductor-mounting substrateDAINIPPON PRINTING CO LTD·Filed 2015·Granted Sep 10, 2019·0 cites·24 claims
- 4532US2004043232A1Laminate and use thereofFiled 2001·Application pending·0 cites
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