Assignee
SAKAYORI KATSUYA
JP·8 granted patents·2 pending applications·20 citations·filing 2005–2011
Top patents by PatentIndex Score
10 records- 0186US8071273B2Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin compositionSAKAYORI KATSUYA·Filed 2009·Granted Dec 6, 2011·7 cites·6 claims
- 0280US8088882B2Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2006·Granted Jan 3, 2012·6 cites·12 claims
- 0379US8211613B2Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the compositionSAKAYORI KATSUYA·Filed 2008·Granted Jul 3, 2012·4 cites·8 claims
- 0469US8859186B2Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin compositionSAKAYORI KATSUYA·Filed 2011·Granted Oct 14, 2014·1 cites·16 claims
- 0567US8252423B2Laminate and use thereofSAKAYORI KATSUYA·Filed 2010·Granted Aug 28, 2012·2 cites·1 claims
- 0659US8742059B2Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2011·Granted Jun 3, 2014·0 cites·4 claims
- 0752US8066891B2Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the filmSAKAYORI KATSUYA·Filed 2006·Granted Nov 29, 2011·0 cites·17 claims
- 0849US2007100129A1Low expansion polyimide, resin composition and article using thereofSAKAYORI KATSUYA·Filed 2006·Application pending·0 cites
- 0948US8308967B2Wet etched insulator and electronic circuit componentSAKAYORI KATSUYA·Filed 2011·Granted Nov 13, 2012·0 cites·5 claims
- 1045US2005256295A1Polymer compound, highly transparent polyimide, resin composition and articleSAKAYORI KATSUYA·Filed 2005·Application pending·0 cites
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