Inventor · disambiguated record
Kong Chan
Also filed as: CHAN KONG · CHAN KONG LUNG SAMUEL · CHAN Kong Lung
9 granted patents·4 pending applications·36 citations·filing 2016–2023
82Inventor score
Top patents by PatentIndex Score
13 records- 0196US11348769B2Plasma-enhanced anneal chamber for wafer outgassingAPPLIED MATERIALS INC·Filed 2020·Granted May 31, 2022·5 cites·12 claims
- 0288US10770272B2Plasma-enhanced anneal chamber for wafer outgassingAPPLIED MATERIALS INC·Filed 2017·Granted Sep 8, 2020·5 cites·12 claims
- 0383USD790039SShowerhead for a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2016·Granted Jun 20, 2017·25 cites·1 claims
- 0472US2024102951A1Process for determining the type of a diamondGOLDWAY TECH LIMITED·Filed 2023·Application pending·0 cites
- 0566US10741428B2Semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2017·Granted Aug 11, 2020·1 cites·16 claims
- 0664US11835466B2Diamond clarity measurement process and systemGOLDWAY TECH LIMITED·Filed 2021·Granted Dec 5, 2023·0 cites·16 claims
- 0762US11879859B2Process for determining the type of a diamondGOLDWAY TECH LIMITED·Filed 2020·Granted Jan 23, 2024·0 cites·11 claims
- 0851US11016033B2Diamond clarity measurement process and systemGOLDWAY TECH LIMITED·Filed 2018·Granted May 25, 2021·0 cites·18 claims
- 0946US11978646B2Thermal chamber with improved thermal uniformityAPPLIED MATERIALS INC·Filed 2018·Granted May 7, 2024·0 cites·18 claims
- 1044US10762666B2Colour grading process and system for diamondsGOLDWAY TECH LIMITED·Filed 2018·Granted Sep 1, 2020·0 cites·22 claims
- 1143US2021310950A1Device, process and system for gemological characterizationGOLDWAY TECH LIMITED·Filed 2019·Application pending·0 cites
- 1240US2022229138A1Process of enhancing nitrogen vacancy (nv) center spin excitation in hyperpolarization applicationMASTER DYNAMIC LTD·Filed 2019·Application pending·0 cites
- 1337US2017221701A1Rtp process for directed self-aligned patternsAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →