Inventor · disambiguated record

Dong Yun Jung

Also filed as: JUNG DONG YUN

18 granted patents·8 pending applications·54 citations·filing 2003–2023

91Inventor score

Technology areasH10W H10D H01L H03D H03F

Files withELECTRONICS & TELECOMMUNICATIONS RES INST15 SAMSUNG ELECTRONICS CO LTD3 JUNG DONG-YUN2 KOREA ADVANCED INST SCI & TECH2 UNIV INFORMATION & COMM2

Top patents by PatentIndex Score

26 records

0192US10734878B2Spherical wheel motor and control system thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2018·Granted Aug 4, 2020·7 cites·20 claims
0290US10381736B2Method and device for extending beam area in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 13, 2019·10 cites·19 claims
0387US9748941B2Power semiconductor module and method for stabilizing thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Aug 29, 2017·6 cites·10 claims
0483US8022784B2Planar transmission line-to-waveguide transition apparatus having an embedded bent stubKOREA ADVANCED INST SCI & TECH·Filed 2009·Granted Sep 20, 2011·10 cites·13 claims
0581US9948484B2Method and apparatus for direct conversion receiver correcting direct current offsetSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 17, 2018·4 cites·18 claims
0675US9294178B2Method and apparatus for transceiving for beam forming in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·3 cites·21 claims
0774US9755027B2Electronical deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Sep 5, 2017·2 cites·8 claims
0873US9613884B2Semiconductor deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2015·Granted Apr 4, 2017·2 cites·16 claims
0967US8183896B2Resistive frequency mixing apparatus and signal processing method using the sameJUNG DONG YUN·Filed 2008·Granted May 22, 2012·5 cites·16 claims
1061US9800181B2Hybrid diode deviceELECTRONICS AND TELECOMMUNCATIONS RES INST·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
1156US10848074B2High voltage bridge rectifierELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2019·Granted Nov 24, 2020·0 cites·14 claims
1253US2023231404A1Semiconductor pre-charger module in battery systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
1345US2022299554A1Apparatus for electrostatic discharge testELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
1445US2022020671A1Flip-stack type semiconductor package and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
1544US11637192B2Metal oxide semiconductor-controlled thyristor device having uniform turn-off characteristic and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 25, 2023·0 cites·9 claims
1644US2021335681A1Ceramic stacked semiconductor package having improved anti-humidity and reliability and method of packaging ceramic stacked semiconductorELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
1742US11784247B2MOS(metal oxide silicon) controlled thyristor deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
1841US2010090780A1Phase shifterKOREA ADVANCED INST SCI & TECH·Filed 2009·Application pending·0 cites
1940US10014401B2Semiconductor device with passivation layer for control of leakage currentELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Jul 3, 2018·0 cites·16 claims
2040US9905654B2Bridge diodeELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Granted Feb 27, 2018·0 cites·14 claims
2140US6914488B2Broadband amplification apparatus for bandwidth expansionUNIV INFORMATION & COMM·Filed 2003·Granted Jul 5, 2005·2 cites·7 claims
2239US7030701B2Transimpedance amplification apparatus with source follower structureUNIV INFORMATION & COMM·Filed 2003·Granted Apr 18, 2006·2 cites·7 claims
2336US7264987B2Method of fabricating optoelectronic integrated circuit chipKOREA ELECTRONICS TELECOMM·Filed 2004·Granted Sep 4, 2007·0 cites·8 claims
2434US2017062385A1Power converting deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
2534US2016380119A1Semiconductor device and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
2633US2013194754A1Transmission line transition having vertical structure and single chip package using land grip array couplingJUNG DONG-YUN·Filed 2011·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →