Inventor · disambiguated record
Christopher D. Muzzy
Also filed as: MUZZY CHRISTOPHER · MUZZY CHRISTOPHER D · MUZZY CHRISTOPHER DAVID
140 granted patents·17 pending applications·840 citations·filing 2002–2024
99Inventor score
Files withIBM110DAUBENSPECK TIMOTHY H28GLOBALFOUNDRIES INC9ARVIN CHARLES L3DAUBENSPECK TIMOTHY HARRISON3
Top patents by PatentIndex Score
157 records- 0198US7323780B2Electrical interconnection structure formationIBM·Filed 2005·Granted Jan 29, 2008·62 cites·11 claims
- 0296US9911708B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted Mar 6, 2018·9 cites·20 claims
- 0396US9799618B1Mixed UBM and mixed pitch on a single dieIBM·Filed 2016·Granted Oct 24, 2017·9 cites·7 claims
- 0496US8742594B2Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstopDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jun 3, 2014·30 cites·15 claims
- 0596US8508043B2Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bumpDAUBENSPECK TIMOTHY H·Filed 2011·Granted Aug 13, 2013·24 cites·19 claims
- 0696US7825511B2Undercut-free BLM process for Pb-free and Pb-reduced C4IBM·Filed 2009·Granted Nov 2, 2010·37 cites·7 claims
- 0795US9679806B1Nanowires for pillar interconnectsIBM·Filed 2016·Granted Jun 13, 2017·11 cites·7 claims
- 0895US9583451B2Conductive pillar shaped for solder confinementIBM·Filed 2015·Granted Feb 28, 2017·8 cites·19 claims
- 0995US7482675B2Probing pads in kerf area for wafer testingIBM·Filed 2005·Granted Jan 27, 2009·40 cites·8 claims
- 1094US7459785B2Electrical interconnection structure formationIBM·Filed 2007·Granted Dec 2, 2008·28 cites·10 claims
- 1193US8298930B2Undercut-repair of barrier layer metallurgy for solder bumps and methods thereofARVIN CHARLES L·Filed 2010·Granted Oct 30, 2012·16 cites·19 claims
- 1292US10600751B2Conductive pillar shaped for solder confinementIBM·Filed 2019·Granted Mar 24, 2020·4 cites·20 claims
- 1391US9741682B2Structures to enable a full intermetallic interconnectIBM·Filed 2015·Granted Aug 22, 2017·6 cites·6 claims
- 1491US7485564B2Undercut-free BLM process for Pb-free and Pb-reduced C4IBM·Filed 2007·Granted Feb 3, 2009·20 cites·20 claims
- 1591US7348210B2Post bump passivation for soft error protectionIBM·Filed 2005·Granted Mar 25, 2008·25 cites·5 claims
- 1691US7329951B2Solder bumps in flip-chip technologiesIBM·Filed 2005·Granted Feb 12, 2008·20 cites·1 claims
- 1789US9059106B2Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chipIBM·Filed 2012·Granted Jun 16, 2015·9 cites·18 claims
- 1889US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 1989US8350383B2IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methodsIBM·Filed 2009·Granted Jan 8, 2013·16 cites·19 claims
- 2089US7985671B2Structures and methods for improving solder bump connections in semiconductor devicesIBM·Filed 2008·Granted Jul 26, 2011·18 cites·22 claims
- 2189US7316940B2Chip dicingIBM·Filed 2006·Granted Jan 8, 2008·12 cites·10 claims
- 2288US8476762B2Ni plating of a BLM edge for Pb-free C4 undercut controlDAUBENSPECK TIMOTHY H·Filed 2012·Granted Jul 2, 2013·8 cites·16 claims
- 2388US8198133B2Structures and methods to improve lead-free C4 interconnect reliabilityDAUBENSPECK TIMOTHY H·Filed 2009·Granted Jun 12, 2012·16 cites·12 claims
- 2488US7541272B2Damascene patterning of barrier layer metal for C4 solder bumpsIBM·Filed 2007·Granted Jun 2, 2009·14 cites·11 claims
- 2587US10790253B2Conductive pillar shaped for solder confinementIBM·Filed 2019·Granted Sep 29, 2020·2 cites·20 claims
- 2687US8361598B2Substrate anchor structure and methodIBM·Filed 2011·Granted Jan 29, 2013·8 cites·12 claims
- 2786US9798088B2Barrier structures for underfill blockout regionsGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 24, 2017·5 cites·15 claims
- 2886US7859122B2Final via structures for bond pad-solder ball interconnectionsIBM·Filed 2008·Granted Dec 28, 2010·14 cites·14 claims
- 2986US7635643B2Method for forming C4 connections on integrated circuit chips and the resulting devicesIBM·Filed 2006·Granted Dec 22, 2009·14 cites·20 claims
- 3086US7256503B2Chip underfill in flip-chip technologiesIBM·Filed 2006·Granted Aug 14, 2007·14 cites·20 claims
- 3185US9159696B2Plug via formation by patterned plating and polishingIBM·Filed 2013·Granted Oct 13, 2015·6 cites·20 claims
- 3285US7176583B2Damascene patterning of barrier layer metal for C4 solder bumpsIBM·Filed 2004·Granted Feb 13, 2007·35 cites·10 claims
- 3384US10290599B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted May 14, 2019·2 cites·10 claims
- 3484US8138099B1Chip package solder interconnect formed by surface tensionDAUBENSPECK TIMOTHY H·Filed 2010·Granted Mar 20, 2012·7 cites·20 claims
- 3583US9466547B1Passivation layer topographyGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·4 cites·17 claims
- 3683US8927334B2Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip packageIBM·Filed 2012·Granted Jan 6, 2015·7 cites·8 claims
- 3783US8492892B2Solder bump connectionsDAUBENSPECK TIMOTHY H·Filed 2010·Granted Jul 23, 2013·6 cites·19 claims
- 3883US8159067B2Underfill flow guide structuresDAUBENSPECK TIMOTHY H·Filed 2008·Granted Apr 17, 2012·8 cites·11 claims
- 3983US7935408B2Substrate anchor structure and methodIBM·Filed 2007·Granted May 3, 2011·10 cites·12 claims
- 4083US7601628B2Wire and solder bond forming methodsIBM·Filed 2006·Granted Oct 13, 2009·11 cites·20 claims
- 4183US7462509B2Dual-sided chip attached modulesIBM·Filed 2006·Granted Dec 9, 2008·10 cites·12 claims
- 4283US7405139B2Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etchIBM·Filed 2006·Granted Jul 29, 2008·9 cites·5 claims
- 4382US9947598B1Determining crackstop strength of integrated circuit assembly at the wafer levelIBM·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 4482US8937009B2Far back end of the line metallization method and structuresIBM·Filed 2013·Granted Jan 20, 2015·6 cites·18 claims
- 4582US8933540B2Thermal via for 3D integrated circuits structuresIBM·Filed 2013·Granted Jan 13, 2015·6 cites·9 claims
- 4681US7479447B2Method of forming a crack stop void in a low-k dielectric layer between adjacent fusesIBM·Filed 2006·Granted Jan 20, 2009·10 cites·20 claims
- 4781US6924210B1Chip dicingIBM·Filed 2004·Granted Aug 2, 2005·23 cites·20 claims
- 4880US7112470B2Chip dicingIBM·Filed 2004·Granted Sep 26, 2006·19 cites·10 claims
- 4978US10192839B2Conductive pillar shaped for solder confinementIBM·Filed 2017·Granted Jan 29, 2019·1 cites·10 claims
- 5078US9231046B2Capacitor using barrier layer metallurgyIBM·Filed 2013·Granted Jan 5, 2016·4 cites·20 claims
Showing the top 50 of 157 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →