Inventor · disambiguated record
Jae-Cheon Doh
Also filed as: DOH JAE-CHEON
11 granted patents·11 pending applications·56 citations·filing 2002–2014
87Inventor score
Files withSAMSUNG ELECTRO MECH10SAMSUNG ELECTRONICS CO LTD6CHUNG YE-CHUNG1KANG JOON SEOK1KIM TAE HOON1
Top patents by PatentIndex Score
22 records- 0189US7696004B2Wafer level package fabrication methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 13, 2010·23 cites·24 claims
- 0284US7659936B2Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 9, 2010·6 cites·14 claims
- 0381US8842438B23D power module packageKIM TAE HOON·Filed 2011·Granted Sep 23, 2014·6 cites·4 claims
- 0478US9510461B2Electric component module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 29, 2016·6 cites·14 claims
- 0577US7484901B2Image sensor camera module and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·8 cites·15 claims
- 0672US8410465B2Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensorLEE SEUNG SEOUP·Filed 2010·Granted Apr 2, 2013·3 cites·14 claims
- 0760US7683476B2Semiconductor package film having reinforcing member and related display moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 23, 2010·1 cites·6 claims
- 0860US7670878B2Method for manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Mar 2, 2010·2 cites·10 claims
- 0951US8054370B2Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·1 cites·2 claims
- 1050US9048199B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Granted Jun 2, 2015·0 cites·3 claims
- 1148US2014313676A1Electronic component packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1247US8779580B2Electronic component package and manufacturing method thereofKANG JOON-SEOK·Filed 2008·Granted Jul 15, 2014·0 cites·5 claims
- 1346US2007042166A1Tape substrate having reinforcement layer for tape packagesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1445US2008296577A1Camera module packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1545US2008296714A1Wafer level package of image sensor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1643US2008063789A1Tape substrate having reinforcement layer for tape packagesCHUNG YE-CHUNG·Filed 2007·Application pending·0 cites
- 1742US2015062854A1Electronic component module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1841US2013026616A1Power device package module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1941US2008211083A1Electronic package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2039US2005258502A1Chip package, image sensor module including chip package, and manufacturing method thereofKONG YUNG-CHEOL·Filed 2005·Application pending·0 cites
- 2137US2011298103A1Semiconductor package and method of manufacturing the semiconductor packageYOO DO-JAE·Filed 2010·Application pending·0 cites
- 2235US2002113304A1Dual die package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →