Inventor · disambiguated record
Yukitoshi Hase
Also filed as: HASE YUKITOSHI
9 granted patents·10 pending applications·33 citations·filing 2004–2012
82Inventor score
Top patents by PatentIndex Score
19 records- 0172US7384811B2Method of separating semiconductor wafer, and separating apparatus using the sameNITTO DENKO CORP·Filed 2004·Granted Jun 10, 2008·16 cites·10 claims
- 0269US7811899B2Method for laminating substrate and apparatus using the methodNITTO DENKO CORP·Filed 2007·Granted Oct 12, 2010·3 cites·22 claims
- 0365US8109185B2Method for cutting protective tape of semiconductor wafer and protective tape cutting deviceYAMAMOTO MASAYUKI·Filed 2008·Granted Feb 7, 2012·2 cites·7 claims
- 0464US7393757B2Method for separating semiconductor wafer from supporting member, and apparatus using the sameNITTO DENKO CORP·Filed 2004·Granted Jul 1, 2008·10 cites·4 claims
- 0560US2009272403A1Cutter blade cleaning method and cutter blade cleaning device, as well as adhesive tape joining apparatus including the sameYAMAMOTO MASAYUKI·Filed 2009·Application pending·0 cites
- 0659US8349106B2Adhesive tape joining method and adhesive tape joining apparatusNITTO DENKO CORP·Filed 2010·Granted Jan 8, 2013·1 cites·5 claims
- 0750US8038816B2Method and apparatus for separating protective tape from semiconductor waferNITTO DENKO CORP·Filed 2009·Granted Oct 18, 2011·0 cites·8 claims
- 0847US7807004B2Method for joining adhesive tapeNITTO DENKO CORP·Filed 2007·Granted Oct 5, 2010·0 cites·2 claims
- 0947US2009205679A1Cutter blade cleaning method and cutter blade cleaning device, as well as adhesive tape joining apparatus including the sameYAMAMOTO MASAYUKI·Filed 2009·Application pending·0 cites
- 1046US2009095418A1Ultraviolet irradiation method and apparatus using the sameYAMAMOTO MASAYUKI·Filed 2008·Application pending·0 cites
- 1145US7078316B2Substrate joining apparatusNITTO DENKO CORP·Filed 2004·Granted Jul 18, 2006·1 cites·10 claims
- 1242US8960266B2Semiconductor wafer transport method and semiconductor wafer transport apparatusYAMAMOTO MASAYUKI·Filed 2011·Granted Feb 24, 2015·0 cites·8 claims
- 1339US2012247657A1Substrate transfer method and substrate transfer apparatusYAMAMOTO MASAYUKI·Filed 2012·Application pending·0 cites
- 1438US2012082516A1Workpiece transport method and workpiece transport apparatusYAMAMOTO MASAYUKI·Filed 2011·Application pending·0 cites
- 1536US2011073241A1Method and apparatus for separating protective tapeHASE YUKITOSHI·Filed 2010·Application pending·0 cites
- 1636US2010300612A1Wafer mounting method and wafer mounting apparatusYAMAMOTO MASAYUKI·Filed 2010·Application pending·0 cites
- 1735US2011048630A1Protective tape separating method and apparatusHASE YUKITOSHI·Filed 2010·Application pending·0 cites
- 1832US2011045234A1Method and configuration for reinforcing plate materialMIYAMOTO SABURO·Filed 2010·Application pending·0 cites
- 1932US2011056615A1Adhesive tape joining method and adhesive tape joining apparatusMIYAMOTO SABURO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →