Inventor · disambiguated record
Richard Dewitt Crisp
Also filed as: CRISP RICHARD D · CRISP RICHARD DEWITT
108 granted patents·13 pending applications·1,934 citations·filing 1980–2023
99Inventor score
Top patents by PatentIndex Score
121 records- 0199US8670261B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2013·Granted Mar 11, 2014·78 cites·28 claims
- 0299US8405207B1Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Mar 26, 2013·42 cites·30 claims
- 0399US8345441B1Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2011·Granted Jan 1, 2013·70 cites·30 claims
- 0498US8823165B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Sep 2, 2014·34 cites·54 claims
- 0598US8659141B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·37 cites·30 claims
- 0698US8659142B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 0798US8659143B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 0898US8653646B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 18, 2014·31 cites·30 claims
- 0998US8513813B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 20, 2013·39 cites·30 claims
- 1098US8513817B2Memory module in a packageHABA BELGACEM·Filed 2012·Granted Aug 20, 2013·65 cites·50 claims
- 1198US8502390B2De-skewed multi-die packagesCRISP RICHARD DEWITT·Filed 2011·Granted Aug 6, 2013·42 cites·36 claims
- 1298US8441111B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2012·Granted May 14, 2013·49 cites·30 claims
- 1398US8436457B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2011·Granted May 7, 2013·45 cites·30 claims
- 1498US8436477B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted May 7, 2013·48 cites·30 claims
- 1598US8338963B2Multiple die face-down stacking for two or more dieHABA BELGACEM·Filed 2011·Granted Dec 25, 2012·51 cites·30 claims
- 1698US8254155B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 28, 2012·68 cites·30 claims
- 1798US6266730B1High-frequency bus systemRAMBUS INC·Filed 2000·Granted Jul 24, 2001·137 cites·20 claims
- 1897US9000583B2Multiple die in a face down packageTESSERA INC·Filed 2013·Granted Apr 7, 2015·26 cites·5 claims
- 1997US8659139B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 2097US8659140B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 2197US8629545B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Jan 14, 2014·32 cites·28 claims
- 2297US8610260B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Dec 17, 2013·35 cites·31 claims
- 2397US8525327B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Sep 3, 2013·33 cites·30 claims
- 2497US8304881B1Flip-chip, face-up and face-down wirebond combination packageHABA BELGACEM·Filed 2011·Granted Nov 6, 2012·28 cites·22 claims
- 2597US8278764B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Oct 2, 2012·36 cites·30 claims
- 2697US6067594AHigh frequency bus systemRAMBUS INC·Filed 1997·Granted May 23, 2000·125 cites·8 claims
- 2796US8981547B2Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2014·Granted Mar 17, 2015·24 cites·20 claims
- 2896US8917532B2Stub minimization with terminal grids offset from center of packageINVENSAS CORP·Filed 2012·Granted Dec 23, 2014·25 cites·34 claims
- 2993US8928153B2Flip-chip, face-up and face-down centerbond memory wirebond assembliesHABA BELGACEM·Filed 2011·Granted Jan 6, 2015·13 cites·23 claims
- 3093US8786069B1Reconfigurable popINVENSAS CORP·Filed 2013·Granted Jul 22, 2014·14 cites·27 claims
- 3192US9013033B2Multiple die face-down stacking for two or more dieTESSERA INC·Filed 2013·Granted Apr 21, 2015·12 cites·43 claims
- 3292US8723329B1In-package fly-by signalingINVENSAS CORP·Filed 2013·Granted May 13, 2014·13 cites·29 claims
- 3392US5680361AMethod and apparatus for writing to memory componentsRAMBUS INC·Filed 1995·Granted Oct 21, 1997·73 cites·37 claims
- 3491US7793414B2Methods for forming connection structures for microelectronic devicesTESSERA INC·Filed 2006·Granted Sep 14, 2010·18 cites·22 claims
- 3590US5844855AMethod and apparatus for writing to memory componentsRAMBUS INC·Filed 1997·Granted Dec 1, 1998·60 cites·45 claims
- 3688US10008477B2Microelectronic element with bond elements to encapsulation surfaceINVENSAS CORP·Filed 2016·Granted Jun 26, 2018·5 cites·12 claims
- 3788US8436458B2Flip-chip, face-up and face-down wirebond combination packageTESSERA INC·Filed 2012·Granted May 7, 2013·7 cites·21 claims
- 3886US8787032B2Enhanced stacked microelectronic assemblies with central contactsHABA BELGACEM·Filed 2011·Granted Jul 22, 2014·7 cites·12 claims
- 3985US9806017B2Flip-chip, face-up and face-down centerbond memory wirebond assembliesTESSERA INC·Filed 2015·Granted Oct 31, 2017·4 cites·20 claims
- 4085US9679838B2Stub minimization for assemblies without wirebonds to package substrateINVENSAS CORP·Filed 2016·Granted Jun 13, 2017·3 cites·20 claims
- 4184US8222725B2Metal can impedance control structureHABA BELGACEM·Filed 2010·Granted Jul 17, 2012·7 cites·64 claims
- 4283US7545029B2Stack microelectronic assembliesTESSERA INC·Filed 2006·Granted Jun 9, 2009·13 cites·49 claims
- 4383US5940340AMethod and apparatus for writing to memory componentsRAMBUS INC·Filed 1997·Granted Aug 17, 1999·37 cites·16 claims
- 4482US8786083B2Impedance controlled packages with metal sheet or 2-layer RDLHABA BELGACEM·Filed 2010·Granted Jul 22, 2014·5 cites·29 claims
- 4582US4866676ATesting arrangement for a DRAM with redundancyMOTOROLA INC·Filed 1988·Granted Sep 12, 1989·49 cites·5 claims
- 4680US8569884B2Multiple die in a face down packageHABA BELGACEM·Filed 2011·Granted Oct 29, 2013·4 cites·37 claims
- 4779US4918663ALatch-up control for a CMOS memory with a pumped wellMOTOROLA INC·Filed 1987·Granted Apr 17, 1990·37 cites·15 claims
- 4879US2023385224A1Low-Pincount High-Bandwidth Memory And Memory BusETRON TECH INC·Filed 2023·Application pending·0 cites
- 4978US9355996B2Microelectronic package with consolidated chip structuresINVENSAS CORP·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 5078US9287216B2Memory module in a packageINVENSAS CORP·Filed 2014·Granted Mar 15, 2016·3 cites·19 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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