Inventor · disambiguated record
Tong-Hong Wang
Also filed as: WANG TONG · WANG TONG-HONG
8 granted patents·12 pending applications·21 citations·filing 2004–2023
80Inventor score
Files withADVANCED SEMICONDUCTOR ENG9FERGUSSONS ADVANCED COMPOSITE TECH LIMITED2UNIV CHANG GUNG2UNIV NORTHEASTERN2ADVANCE SEMICONDUCTOR ENGINEER1
Top patents by PatentIndex Score
20 records- 0173US8022534B2Semiconductor package using an active type heat-spreading elementADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 20, 2011·6 cites·19 claims
- 0271US7482204B2Chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 27, 2009·4 cites·8 claims
- 0362US7335982B2Chip package structure and chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 26, 2008·2 cites·13 claims
- 0459US2025009763A1Methods for extending lifespan and/or delaying agingUNIV CHANG GUNG·Filed 2023·Application pending·0 cites
- 0557US7259456B2Heat dissipation apparatus for package deviceADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 21, 2007·9 cites·13 claims
- 0656US2019340537A1Personalized Match Score For PlacesGOOGLE LLC·Filed 2019·Application pending·0 cites
- 0754US2024091191A1Uses of corylin and/or neobavaisoflavone in treating symptoms associated with senescenceUNIV CHANG GUNG·Filed 2022·Application pending·0 cites
- 0851US2021254194A1Preparation method for magnesium matrix compositeUNIV NORTHEASTERN·Filed 2019·Application pending·0 cites
- 0949US2008272486A1Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1047US12368412B2Receiving module, packaging structure, printed circuit board, and electronic deviceHONOR DEVICE CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·17 claims
- 1144US11179770B2Electromagnetic semi-continuous casting device and method having accurately matched and adjusted cooling processUNIV NORTHEASTERN·Filed 2019·Granted Nov 23, 2021·0 cites·10 claims
- 1244US2009230544A1Heat sink structure and semiconductor package as well as method for configuring heat sinks on a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 1343US2008042263A1Reinforced semiconductor package and stiffener thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1442US2007145604A1Chip structure and chip manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 1538US2005263883A1Asymmetric bump structureADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
- 1638US2010275440A1Highly conductive thermal interface and no pump-out thermal interface greases and method thereforePAISNER SARA NAOMI·Filed 2010·Application pending·0 cites
- 1738US2006197219A1Heat sink and package structureLEE CHANG-CHI·Filed 2006·Application pending·0 cites
- 1835US10780678B2Composite sandwich structureFERGUSSONS ADVANCED COMPOSITE TECH LIMITED·Filed 2016·Granted Sep 22, 2020·0 cites·12 claims
- 1935US2004266066A1Bump structure of a semiconductor wafer and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 2033US11059244B2Method of making a composite structureFERGUSSONS ADVANCED COMPOSITE TECH LIMITED·Filed 2016·Granted Jul 13, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →