Inventor · disambiguated record
Ikuo Sawada
Also filed as: SAWADA IKUO
17 granted patents·16 pending applications·58 citations·filing 1990–2022
91Inventor score
Files withTOKYO ELECTRON LTD17SAWADA IKUO5JAPAN AGENCY MARINE EARTH SCI4TOA CORP2JAPAN AGENCY FOR MARINE-EARTH SCIENCE AND TECH1
Top patents by PatentIndex Score
33 records- 0187US8636871B2Plasma processing apparatus, plasma processing method and storage mediumSAWADA IKUO·Filed 2007·Granted Jan 28, 2014·14 cites·18 claims
- 0281US7449414B2Method of treating a mask layer prior to performing an etching processTOKYO ELECTRON LTD·Filed 2006·Granted Nov 11, 2008·7 cites·21 claims
- 0376US8696814B2Film deposition apparatus and film deposition methodMORISAKI EISUKE·Filed 2007·Granted Apr 15, 2014·6 cites·12 claims
- 0474US7642193B2Method of treating a mask layer prior to performing an etching processTOKYO ELECTRON LTD·Filed 2006·Granted Jan 5, 2010·4 cites·23 claims
- 0574US7572386B2Method of treating a mask layer prior to performing an etching processTOKYO ELECTRON LTD·Filed 2006·Granted Aug 11, 2009·4 cites·19 claims
- 0673US9165810B2Conveyance device and substrate processing systemTOKYO ELECTRON LTD·Filed 2012·Granted Oct 20, 2015·3 cites·12 claims
- 0772US9359870B2Method and system for recovering ocean floor hydrothermal mineral resourcesJAPAN AGENCY MARINE EARTH SCI·Filed 2013·Granted Jun 7, 2016·4 cites·15 claims
- 0872US9252001B2Plasma processing apparatus, plasma processing method and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted Feb 2, 2016·2 cites·4 claims
- 0966US9202731B2Liquid processing apparatus, liquid processing method, and recording medium having program for executing liquid processing method recorded thereinKASAI SHIGERU·Filed 2011·Granted Dec 1, 2015·2 cites·9 claims
- 1064US9343295B2Vaporizing unit, film forming apparatus, film forming method, computer program and storage mediumTOKYO ELECTRON LTD·Filed 2014·Granted May 17, 2016·1 cites·6 claims
- 1163US8419960B2Plasma processing apparatus and methodSAWADA IKUO·Filed 2009·Granted Apr 16, 2013·2 cites·20 claims
- 1261US9461329B2Power generation systemJAPAN AGENCY FOR MARINE-EARTH SCIENCE AND TECH·Filed 2013·Granted Oct 4, 2016·2 cites·6 claims
- 1356US2014373783A1Film forming deviceTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1454US5137077AMethod of controlling flow of molten steel in moldNIPPON STEEL CORP·Filed 1990·Granted Aug 11, 1992·7 cites·2 claims
- 1554US2014138030A1Capacitively coupled plasma equipment with uniform plasma densityTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 1652US2011240222A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 1751US2010297346A1Vaporizing unit, film forming apparatus, film forming method, computer program and storage mediumTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 1850US12012836B2Water bottom resource collecting system and collecting methodTOA CORP·Filed 2022·Granted Jun 18, 2024·0 cites·14 claims
- 1949US2013011555A1Coating apparatus and coating methodTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2048US2009184109A1Processing apparatus and process methodTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2148US2009162547A1Coating Apparatus and Coating MethodSAWADA IKUO·Filed 2006·Application pending·0 cites
- 2247US2012247390A1Film formation apparatusSAWADA IKUO·Filed 2010·Application pending·0 cites
- 2345US12084948B2Method for recovering rare-earth mud, and recovery systemJAPAN AGENCY MARINE EARTH SCI·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
- 2445US2024003253A1Water bottom resource collecting methodTOA CORP·Filed 2022·Application pending·0 cites
- 2543US2014141619A1Capacitively coupled plasma equipment with uniform plasma densityTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2642US2013081761A1Radical passing device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2012·Application pending·0 cites
- 2741US2006096531A1Processing device and processing methodTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
- 2840US2008311313A1Film Forming Method and Film Forming ApparatusTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 2940US2009194236A1Plasma processing equipmentUNIV KYOTO·Filed 2005·Application pending·0 cites
- 3039US11454075B2Continuous drilling systemJAPAN AGENCY MARINE EARTH SCI·Filed 2019·Granted Sep 27, 2022·0 cites·6 claims
- 3137US11225844B2Submarine drilling support systemJAPAN AGENCY MARINE EARTH SCI·Filed 2018·Granted Jan 18, 2022·0 cites·13 claims
- 3237US2005211167A1Processing device and processing methodTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
- 3337US2012160833A1Heat treatment apparatusSAWADA IKUO·Filed 2011·Application pending·0 cites
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