Inventor · disambiguated record
Yuan-Lung Liu
Also filed as: LIU YUAN · LIU YUAN-LUNG
11 granted patents·2 pending applications·77 citations·filing 1996–2024
89Inventor score
Top patents by PatentIndex Score
13 records- 0185US12509556B2Functionalized hydrogenated interpolymer with non-hydrogenated segmentBRIDGESTONE CORP·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 0284US9602739B1Lookup table interpolation in a film emulation camera systemVisual Supply Company·Filed 2016·Granted Mar 21, 2017·4 cites·20 claims
- 0381US9681064B1Lookup table interpolation in a film emulation camera systemVisual Supply Company·Filed 2017·Granted Jun 13, 2017·3 cites·19 claims
- 0474US11970581B2Functionalized hydrogenated interpolymer with non-hydrogenated segmentBRIDGESTONE CORP·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 0568US6638867B2Method for forming a top interconnection level and bonding pads on an integrated circuit chipTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 28, 2003·13 cites·16 claims
- 0665US6358831B1Method for forming a top interconnection level and bonding pads on an integrated circuit chipTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 19, 2002·27 cites·15 claims
- 0763US6875682B1Mesh pad structure to eliminate IMD crack on padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 5, 2005·10 cites·26 claims
- 0857US7759797B2Bonding pad structure to minimize IMD crackingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 20, 2010·1 cites·18 claims
- 0956US9807315B1Lookup table interpolation in a film emulation camera systemVisual Supply Company·Filed 2017·Granted Oct 31, 2017·0 cites·20 claims
- 1054US5705441AIon implant silicon nitride mask for a silicide free contact region in a self aligned silicide processTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jan 6, 1998·17 cites·14 claims
- 1148US2023126418A1Hydrogenated polymers and rubber compositions incorporating the sameBRIDGESTONE CORP·Filed 2020·Application pending·0 cites
- 1246US7135395B2Bonding pad structure to minimize IMD crackingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 14, 2006·2 cites·15 claims
- 1345US2019070751A1Slicing method and a slicing apparatus for an ingotZING SEMICONDUCTOR CORP·Filed 2018·Application pending·0 cites
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