Inventor · disambiguated record
Shu-Huei Suen
Also filed as: SUEN SHU-HUEI
19 granted patents·5 pending applications·32 citations·filing 2001–2024
91Inventor score
Top patents by PatentIndex Score
24 records- 0190US10867840B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·5 cites·20 claims
- 0290US10510553B1Dry ashing by secondary excitationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 0382US12237214B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0481US12217936B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·19 claims
- 0580US12153350B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0680US2025044708A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0778US8544651B2Wafer transfer pod for reducing wafer particulate contaminationZHANG YING·Filed 2012·Granted Oct 1, 2013·5 cites·17 claims
- 0877US11735469B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 0977US2024379378A1Metal Contacts on Metal Gates and Methods ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1076US11854766B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1176US11796922B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 24, 2023·1 cites·10 claims
- 1275US11404245B2DC bias in plasma processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 2, 2022·1 cites·20 claims
- 1375US10943791B2Pattern formation method and method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·1 cites·20 claims
- 1474US10755945B2Metal contacts on metal gates and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 1571US11322393B2Method of forming a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 1669US10157775B2Method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·1 cites·20 claims
- 1768US11626292B2Pattern formation method and method for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1863US9484207B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 1, 2016·1 cites·14 claims
- 1962US2020388504A1Metal Contacts on Metal Gates and Methods ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Application pending·0 cites
- 2058US6500725B1Microelectronic fabrication method providing alignment mark and isolation trench of identical depthTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 31, 2002·8 cites·9 claims
- 2157US2020098588A1Dry Ashing by Secondary ExcitationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Application pending·0 cites
- 2248US7001836B2Two step trench definition procedure for formation of a dual damascene opening in a stack of insulator layersTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Feb 21, 2006·3 cites·29 claims
- 2341US9472444B2Wafer support deviceCHENG TIEN-CHIH·Filed 2012·Granted Oct 18, 2016·0 cites·19 claims
- 2441US2016247709A1Wafer support deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →