Inventor · disambiguated record
Ian Hu
Also filed as: HU IAN
21 granted patents·5 pending applications·42 citations·filing 2017–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0195US10453802B2Semiconductor package structure, semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 22, 2019·17 cites·19 claims
- 0294US11901252B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 13, 2024·2 cites·16 claims
- 0393US12111114B2Heat transfer element, method for forming the same and semiconductor structure comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 8, 2024·5 cites·8 claims
- 0488US11410902B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 9, 2022·4 cites·12 claims
- 0584US11375124B2Optical measurement equipment and method for measuring warpage of a workpieceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 28, 2022·4 cites·21 claims
- 0683US12300560B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted May 13, 2025·0 cites·6 claims
- 0782US10522508B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 0881US2025266313A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0975US10985085B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 20, 2021·2 cites·25 claims
- 1074US11282767B2Semiconductor package structure and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 22, 2022·2 cites·19 claims
- 1170US10861726B2Apparatus and method for measuring warpageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 8, 2020·1 cites·27 claims
- 1266US12322672B2Semiconductor package structure and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 3, 2025·0 cites·8 claims
- 1365US11152274B2Multi-moldings fan-out package and processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 19, 2021·1 cites·11 claims
- 1461US2025346852A1Engineered Photosynthetic OrganismsPHYCOBLOOM LTD·Filed 2023·Application pending·0 cites
- 1554US2020161206A1Semiconductor package structure and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 1653US11482482B2Substrate structures, methods for forming the same and semiconductor device structures comprising the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 25, 2022·0 cites·9 claims
- 1753US11217502B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 1851US11410934B2Substrate and semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 1950US11024557B2Semiconductor package structure having vapor chamber thermally connected to a surface of the semiconductor dieADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 2049US11139226B2Semiconductor package structure and assembly structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 2148US11139222B2Electronic device comprising heat pipe contacting a cover structure for heat dissipationADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 2247US2022093528A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 2346US11081420B2Substrate structure and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 2443US10410942B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 10, 2019·0 cites·10 claims
- 2543US2021265273A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 2635US11075186B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 27, 2021·0 cites·23 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →