Inventor · disambiguated record
Wen-Cheng Chien
Also filed as: CHIEN WEN-CHENG
29 granted patents·11 pending applications·332 citations·filing 1997–2022
97Inventor score
Top patents by PatentIndex Score
40 records- 0193US8367477B2Electronic device package and method for forming the sameCHIEN WEN-CHENG·Filed 2010·Granted Feb 5, 2013·16 cites·8 claims
- 0289US8552547B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 8, 2013·7 cites·7 claims
- 0386US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0477US6624465B1Multi-layer spacer technology for flash EEPROMTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 23, 2003·21 cites·3 claims
- 0576US8772919B2Image sensor package with trench insulator and fabrication method thereofCHIEN WEN-CHENG·Filed 2010·Granted Jul 8, 2014·5 cites·26 claims
- 0675US8823179B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2008·Granted Sep 2, 2014·5 cites·24 claims
- 0774US8384222B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2011·Granted Feb 26, 2013·3 cites·19 claims
- 0874US5879993ANitride spacer technology for flash EPROMTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Mar 9, 1999·35 cites·20 claims
- 0973US8866268B2Semiconductor package structure and manufacturing method thereofWU SHANG-YI·Filed 2011·Granted Oct 21, 2014·4 cites·20 claims
- 1073US8431950B2Light emitting device package structure and fabricating method thereofTSAI CHIA-LUN·Filed 2009·Granted Apr 30, 2013·5 cites·10 claims
- 1170US6071826AMethod of manufacturing CMOS image sensor leakage free with double layer spacerTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 6, 2000·38 cites·37 claims
- 1269US6001690AMethod of forming flash EPROM by using iso+aniso silicon nitride spacer etching technologyTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 14, 1999·29 cites·33 claims
- 1368US9190362B2Image sensor package with trench insulator and fabrication method thereofXINTEC INC·Filed 2014·Granted Nov 17, 2015·2 cites·20 claims
- 1468US6031264ANitride spacer technology for flash EPROMTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 29, 2000·26 cites·17 claims
- 1567US8319347B2Electronic device package and fabrication method thereofTSAI CHIA-LUN·Filed 2009·Granted Nov 27, 2012·3 cites·28 claims
- 1665US6297160B1Application of pure aluminum to prevent pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 2, 2001·29 cites·23 claims
- 1764US6303510B1Plasma etch method with attenuated patterned layer chargingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 16, 2001·30 cites·13 claims
- 1863US6069042AMulti-layer spacer technology for flash EEPROMTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted May 30, 2000·20 cites·12 claims
- 1959US7968448B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2009·Granted Jun 28, 2011·1 cites·2 claims
- 2057US8232202B2Image sensor package and fabrication method thereofCHIEN WEN-CHENG·Filed 2007·Granted Jul 31, 2012·3 cites·20 claims
- 2156US8643198B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 4, 2014·0 cites·19 claims
- 2255US2023075470A1Catalyst carrier structureYUAN FANG APPLIED MAT CO LTD·Filed 2022·Application pending·0 cites
- 2349US11635087B1Airflow-doubling vane structureYUAN FANG APPLIED MAT CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·6 claims
- 2449US7029596B2Computer integrated manufacturing control system for oxide chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 18, 2006·3 cites·5 claims
- 2549US2023144967A1Active air purification deviceYUAN FANG APPLIED MAT CO LTD·Filed 2021·Application pending·0 cites
- 2648US6338668B1In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolationTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 15, 2002·3 cites·15 claims
- 2748US2015226382A1Electroluminescent device and apparatus applying the sameUNISTARS CORP·Filed 2014·Application pending·0 cites
- 2847US2014045302A1Manufacturing Method of SubmountUNISTARS·Filed 2013·Application pending·0 cites
- 2946US8723214B2Submount and manufacturing method thereofCHIEN WEN-CHENG·Filed 2011·Granted May 13, 2014·0 cites·11 claims
- 3046US6110843AEtch back method for smoothing microbubble-generated defects in spin-on-glass interlayer dielectricTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 29, 2000·12 cites·20 claims
- 3144US6248661B1Method for monitoring bubble formation and abnormal via defects in a spin-on-glass planarization, etchback processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 19, 2001·11 cites·14 claims
- 3244US2006113036A1Computer integrated manufacturing control system for oxide chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 3343US2010013080A1Semiconductor device package with insulator ringCHIEN WEN-CHENG·Filed 2009·Application pending·0 cites
- 3442US2014247585A1Semiconductor lighting apparatusUNISTARS CORP·Filed 2013·Application pending·0 cites
- 3542US2009039455A1Image sensor package with trench insulator and fabrication method thereofXINTEC INC·Filed 2007·Application pending·0 cites
- 3641US2015060911A1Optoelectronic semiconductor device and fabricating method thereofUNISTARS CORP·Filed 2013·Application pending·0 cites
- 3738US6319839B1Approach to form an inter-polysilicon oxide (IPO) layer for charge coupled devicesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 20, 2001·7 cites·22 claims
- 3835US6274397B1Method to preserve the testing chip for package's qualityTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 14, 2001·5 cites·37 claims
- 3935US2017236973A1Packaging method for ultraviolet light emitting diodeUNISTARS CORP·Filed 2016·Application pending·0 cites
- 4033US2016225965A1Packaging structure of light emitting diodes and method thereforUNISTARS CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →