Inventor · disambiguated record
Tetsuya Nitta
Also filed as: NITTA TETSUYA
42 granted patents·9 pending applications·424 citations·filing 1998–2024
97Inventor score
Files withMITSUBISHI ELECTRIC CORP19RENESAS ELECTRONICS CORP15TSUDAKOMA IND CO LTD6RENESAS TECH CORP4TSUJIUCHI MIKIO2
Top patents by PatentIndex Score
51 records- 0195US8357989B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 22, 2013·23 cites·9 claims
- 0292US8692352B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Apr 8, 2014·12 cites·3 claims
- 0392US6821824B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 23, 2004·53 cites·28 claims
- 0492US6307246B1Semiconductor resurf devices formed by oblique trench implantationMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 23, 2001·194 cites·16 claims
- 0588US6518144B2Semiconductor device having trenches and process for sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 11, 2003·42 cites·8 claims
- 0685US7418889B2Index table assemblyTSUDAKOMA IND CO LTD·Filed 2004·Granted Sep 2, 2008·17 cites·4 claims
- 0784US8569839B2Semiconductor device and manufacturing method thereofMORII KATSUMI·Filed 2011·Granted Oct 29, 2013·11 cites·5 claims
- 0883US10249708B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 2, 2019·3 cites·6 claims
- 0983US7339236B2Semiconductor device, driver circuit and manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Mar 4, 2008·11 cites·14 claims
- 1077US8030730B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 4, 2011·4 cites·4 claims
- 1175US9881868B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 30, 2018·3 cites·6 claims
- 1273US7105387B2Semiconductor device and manufacturing method for the sameMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Sep 12, 2006·13 cites·1 claims
- 1373US2024258306A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1472US9153673B2Semiconductor deviceTSUJIUCHI MIKIO·Filed 2012·Granted Oct 6, 2015·3 cites·27 claims
- 1572US7541248B2Integrated semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2007·Granted Jun 2, 2009·3 cites·5 claims
- 1669US10128359B2Semiconductor device with improved short circuit capabilityRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·1 cites·7 claims
- 1769USRE46773ESemiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 3, 2018·1 cites·16 claims
- 1869US8710619B2Semiconductor device and manufacturing method thereofKAWAMATA TATSUYA·Filed 2011·Granted Apr 29, 2014·4 cites·1 claims
- 1969US8344458B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Jan 1, 2013·3 cites·10 claims
- 2068US11986915B2Rotary table deviceTSUDAKOMA IND CO LTD·Filed 2022·Granted May 21, 2024·0 cites·2 claims
- 2167US9583604B2Semiconductor device with improved short circuit capabilityRENESAS ELECTRONICS CORP·Filed 2014·Granted Feb 28, 2017·1 cites·7 claims
- 2265US6949798B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Sep 27, 2005·9 cites·9 claims
- 2364US12009360B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 11, 2024·0 cites·9 claims
- 2464US8581299B2Semiconductor deviceTSUJIUCHI MIKIO·Filed 2012·Granted Nov 12, 2013·2 cites·16 claims
- 2559US9972679B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 15, 2018·1 cites·11 claims
- 2658USRE48450ESemiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Feb 23, 2021·0 cites·11 claims
- 2758US7942080B2Index table assemblyTSUDAKOMA IND CO LTD·Filed 2008·Granted May 17, 2011·1 cites·1 claims
- 2857US2024153989A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2955US7530293B2Index table assemblyTSUDAKOMA IND CO LTD·Filed 2004·Granted May 12, 2009·5 cites·10 claims
- 3053US12328887B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 10, 2025·0 cites·48 claims
- 3153US11621321B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·0 cites·49 claims
- 3253US11239329B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 1, 2022·0 cites·23 claims
- 3353US9806147B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 31, 2017·0 cites·14 claims
- 3453US8704330B2Semiconductor deviceYOSHIHISA YASUKI·Filed 2011·Granted Apr 22, 2014·1 cites·16 claims
- 3553US7186623B2Integrated semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2003·Granted Mar 6, 2007·3 cites·5 claims
- 3652US2010289204A1Force increasing device for clamping device of index tableTSUDAKOMA IND CO LTD·Filed 2009·Application pending·0 cites
- 3750US11777021B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Oct 3, 2023·0 cites·11 claims
- 3849US12501635B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 16, 2025·0 cites·11 claims
- 3949US12154976B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 26, 2024·0 cites·24 claims
- 4049US2005282375A1Semiconductor device and manufacturing method thereofNITTA TETSUYA·Filed 2005·Application pending·0 cites
- 4149US2017365553A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 4248US11875990B2Semiconductor device including IGBT, boundary, and diode regionsMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 16, 2024·0 cites·6 claims
- 4348US2011198726A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONIC CORP·Filed 2011·Application pending·0 cites
- 4447US11569225B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 31, 2023·0 cites·13 claims
- 4547US11462615B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 4, 2022·0 cites·11 claims
- 4647US2015380532A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4745US11322604B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 3, 2022·0 cites·9 claims
- 4843US11908954B2Semiconductor device with insulated gate bipolar transistor region and diode region provided on semiconductor substrate and adjacent to each otherMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 20, 2024·0 cites·10 claims
- 4936US9356135B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 31, 2016·0 cites·20 claims
- 5036US2010181640A1Semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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