Inventor · disambiguated record
Michiharu Honda
Also filed as: HONDA MICHIHARU
13 granted patents·889 citations·filing 1988–2003
94Inventor score
Top patents by PatentIndex Score
13 records- 0197US5198888ASemiconductor stacked deviceHITACHI LTD·Filed 1990·Granted Mar 30, 1993·353 cites·11 claims
- 0294US5028986ASemiconductor device and semiconductor module with a plurality of stacked semiconductor devicesHITACHI LTD·Filed 1988·Granted Jul 2, 1991·115 cites·34 claims
- 0392US5334875AStacked semiconductor memory device and semiconductor memory module containing the sameHITACHI LTD·Filed 1993·Granted Aug 2, 1994·128 cites·56 claims
- 0486US6460755B1Bump forming method and apparatus thereforHITACHI LTD·Filed 1997·Granted Oct 8, 2002·82 cites·7 claims
- 0585US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 0678US6122177ASemiconductor device-mounted on a printed circuit board having solder bumps with excellent connection reliabilityHITACHI LTD·Filed 1998·Granted Sep 19, 2000·47 cites·8 claims
- 0775US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 0862US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 0961US7236158B2Trackball and in-vehicle device controller using the trackballMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 26, 2007·8 cites·12 claims
- 1054US6448646B1Semiconductor device-mounting construction and inspection method thereforHITACHI LTD·Filed 2000·Granted Sep 10, 2002·5 cites·5 claims
- 1153US6861294B2Semiconductor devices and methods of making the devicesRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·4 cites·9 claims
- 1250US5390079ATape carrier packageHITACHI LTD·Filed 1992·Granted Feb 14, 1995·19 cites·2 claims
- 1342US5315482ASemiconductor apparatus of module installing typeHITACHI LTD·Filed 1992·Granted May 24, 1994·12 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Michiharu Honda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →