Inventor · disambiguated record
Chao-Ching Chang
Also filed as: CHANG CHAO-CHING
18 granted patents·8 pending applications·72 citations·filing 2001–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0197US11373971B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·5 cites·20 claims
- 0296US11756913B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·20 claims
- 0396US10043841B1Image sensor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·20 cites·20 claims
- 0494US10134790B1Image sensor and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·12 cites·20 claims
- 0593US12068271B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·1 cites·20 claims
- 0691US2025366255A1Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0787US2025366248A1Isolation structure having an air gap to reduce pixel crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0884US12433059B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 0982US2024371810A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1081US10325949B2Image Sensor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·2 cites·20 claims
- 1179US11749760B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 1278US10497729B2Image sensor having conductive layer and protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·2 cites·20 claims
- 1373US2023268367A1Isolation structure having an air gap to reduce pixel crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1472US10062656B2Composite bond structure in stacked semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 1571US11335817B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 1669US6509754B2CPU adapter for a motherboard test machineASUSTEK COMP INC·Filed 2001·Granted Jan 21, 2003·19 cites·15 claims
- 1768US11652124B2Isolation structure having an air gap to reduce pixel crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 16, 2023·0 cites·20 claims
- 1867US8277702B2Near infrared absorbing agent and near infrared absorbing filmCHANG CHAO-CHING·Filed 2009·Granted Oct 2, 2012·4 cites·10 claims
- 1966US11189654B2Manufacturing methods of semiconductor image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 2062US10050102B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·1 cites·20 claims
- 2162US10038000B2Memory cell and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 31, 2018·1 cites·20 claims
- 2253US2020115823A1Method for preparing hydrophobic fibers by electrospinning of polymerUNIV TAMKANG·Filed 2019·Application pending·0 cites
- 2352US2024363652A1Deep trench capacitor structure and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2447US2017250211A1Semiconductor image sensor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites
- 2544US10186454B2Semiconductor structure having etch stop layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 22, 2019·0 cites·19 claims
- 2640US2012305864A1Near Infrared Absorbing Agent and Near Infrared Absorbing FilmCHANG CHAO-CHING·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →