Inventor · disambiguated record
Jiun-Yen Lai
Also filed as: LAI JIUN-YEN
10 granted patents·10 pending applications·7 citations·filing 2015–2025
80Inventor score
Files withXINTEC INC20
Top patents by PatentIndex Score
20 records- 0195US11309271B2Chip structure and manufacturing method thereofXINTEC INC·Filed 2020·Granted Apr 19, 2022·4 cites·21 claims
- 0279US12473197B2Chip packageXINTEC INC·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 0377US11137559B2Optical chip package and method for forming the sameXINTEC INC·Filed 2020·Granted Oct 5, 2021·1 cites·29 claims
- 0470US9972584B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted May 15, 2018·2 cites·16 claims
- 0567US11935859B2Chip structure and manufacturing method thereofXINTEC INC·Filed 2022·Granted Mar 19, 2024·0 cites·19 claims
- 0665US11873212B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Jan 16, 2024·0 cites·9 claims
- 0763US2025054849A1Chip package and method for forming the sameXINTEC INC·Filed 2024·Application pending·0 cites
- 0862US2025081668A1Chip package and manufacturing method thereofXINTEC INC·Filed 2024·Application pending·0 cites
- 0962US2025056911A1Chip package and manufacturing method thereofXINTEC INC·Filed 2024·Application pending·0 cites
- 1059US11695199B2Antenna device and manufacturing method thereofXINTEC INC·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 1159US2024351865A1Manufacturing method of mems deviceXINTEC INC·Filed 2024·Application pending·0 cites
- 1256US2025372502A1Chip packageXINTEC INC·Filed 2025·Application pending·0 cites
- 1356US2023369362A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 1452US11387201B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jul 12, 2022·0 cites·34 claims
- 1552US11107759B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Aug 31, 2021·0 cites·17 claims
- 1648US2025246530A1Chip package and manufacturing method thereofXINTEC INC·Filed 2025·Application pending·0 cites
- 1746US2021210538A1Chip package and method for forming the sameXINTEC INC·Filed 2020·Application pending·0 cites
- 1835US2016284751A1Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 1934US2017207194A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
- 2033US9761555B2Passive component structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Sep 12, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →