Inventor · disambiguated record
Takayuki Oshima
Also filed as: OSHIMA TAKAYUKI
55 granted patents·5 pending applications·600 citations·filing 1998–2023
98Inventor score
Files withHITACHI LTD12RENESAS ELECTRONICS CORP12RENESAS TECH CORP11HITACHI AUTOMOTIVE SYSTEMS LTD5HITACHI ASTEMO LTD3
Top patents by PatentIndex Score
60 records- 0199US7553756B2Process for producing semiconductor integrated circuit deviceHITACHI LTD·Filed 2006·Granted Jun 30, 2009·222 cites·20 claims
- 0293US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0393US7501347B2Semiconductor device and manufacturing method of the sameHITACHI LTD·Filed 2006·Granted Mar 10, 2009·23 cites·11 claims
- 0492US11654779B2Virtual manual transmission system for electric vehicleTOYOTA MOTOR CO LTD·Filed 2022·Granted May 23, 2023·2 cites·5 claims
- 0591US7411301B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Aug 12, 2008·16 cites·20 claims
- 0690US8247902B2Semiconductor device and manufacturing method of the sameNOGUCHI JUNJI·Filed 2011·Granted Aug 21, 2012·10 cites·12 claims
- 0790US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 0890US6340632B1Method of manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 22, 2002·44 cites·37 claims
- 0989US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 1088US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 1187US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 1286US8586447B2Semiconductor device and manufacturing method of the sameNOGUCHI JUNJI·Filed 2012·Granted Nov 19, 2013·6 cites·2 claims
- 1385US6812127B2Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring groovesRENESAS TECH CORP·Filed 2001·Granted Nov 2, 2004·44 cites·5 claims
- 1484US11906040B2Shifting device for vehicleTOYOTA MOTOR CO LTD·Filed 2022·Granted Feb 20, 2024·1 cites·8 claims
- 1584US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 1683US6555464B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Apr 29, 2003·25 cites·21 claims
- 1780US6122196ASemiconductor non-volatile storage device capable of a high speed reading operationHITACHI LTD·Filed 1998·Granted Sep 19, 2000·35 cites·18 claims
- 1879US7459786B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Dec 2, 2008·9 cites·10 claims
- 1978US6480418B2Semiconductor non-volatile storageHITACHI LTD·Filed 2001·Granted Nov 12, 2002·21 cites·2 claims
- 2077US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 2176US7282434B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Oct 16, 2007·4 cites·11 claims
- 2275US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 2375US6856019B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 15, 2005·14 cites·9 claims
- 2475US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2573US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 2673US7023091B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Apr 4, 2006·13 cites·11 claims
- 2772US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 2871US7977238B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·2 cites·16 claims
- 2970US12330506B2Shifting device for electric vehicle having virtual manual transmission systemTOYOTA MOTOR CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·11 claims
- 3070US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 3170US8122405B2Delay adjusting method and LSI that uses air-gap wiringMATSUMOTO TAKASHI·Filed 2008·Granted Feb 21, 2012·4 cites·28 claims
- 3270US6480518B1Synthetic quartz glass member for use in ArF excimer laser lithographyHERAEUS QUARZGLAS·Filed 2000·Granted Nov 12, 2002·11 cites·15 claims
- 3368US7419916B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·2 cites·8 claims
- 3467US12426223B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 3567US6307780B1Semiconductor non-volatile storageHITACHI LTD·Filed 2000·Granted Oct 23, 2001·13 cites·1 claims
- 3666US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 3766US7786585B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 31, 2010·2 cites·32 claims
- 3865US6528400B2Method of manufacturing a semiconductor deviceHITACHI LTD·Filed 2001·Granted Mar 4, 2003·8 cites·18 claims
- 3964US11871508B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 4056US12095492B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2022·Granted Sep 17, 2024·0 cites·14 claims
- 4155US7911055B2Semiconductor device and manufacturing method of the sameHITACHI LTD·Filed 2009·Granted Mar 22, 2011·0 cites·9 claims
- 4255US6774020B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Aug 10, 2004·4 cites·21 claims
- 4350US7078815B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jul 18, 2006·0 cites·14 claims
- 4449US8841724B2Semiconductor device and its manufacturing methodMIYAKOSHI KENJI·Filed 2010·Granted Sep 23, 2014·1 cites·2 claims
- 4549US2024234359A9Semiconductor Device and Manufacturing Method for Semiconductor DeviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 4648US7109127B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Sep 19, 2006·1 cites·19 claims
- 4747US11161943B2Production method for poly(vinyl alcohol)DENKA COMPANY LTD·Filed 2017·Granted Nov 2, 2021·0 cites·6 claims
- 4846US12087703B2Semiconductor device and in-vehicle electronic control device using the sameHITACHI ASTEMO LTD·Filed 2019·Granted Sep 10, 2024·0 cites·12 claims
- 4945US11587951B2Semiconductor deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2019·Granted Feb 21, 2023·0 cites·8 claims
- 5045US8093723B2Method of manufacturing a semiconductor integrated circuit deviceFUNAKOSHI TAKAKO·Filed 2011·Granted Jan 10, 2012·0 cites·8 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →