Inventor · disambiguated record
Yajun Wei
Also filed as: WEI YAJUN
24 granted patents·2 pending applications·42 citations·filing 2009–2024
93Inventor score
Files withL3 CINCINNATI ELECTRONICS CORP9KONINKLIJKE PHILIPS NV5L 3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP3LEI JIPU2WEI YAJUN2
Top patents by PatentIndex Score
26 records- 0190US9515210B2Diode barrier infrared detector devices and superlattice barrier structuresL-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP·Filed 2014·Granted Dec 6, 2016·8 cites·20 claims
- 0286US9196769B2Superlattice structures and infrared detector devices incorporating the sameL 3 COMM CINCINNATI ELECTRONICS CORP·Filed 2014·Granted Nov 24, 2015·4 cites·16 claims
- 0380US11411040B2Methods for fabricating mechanically stacked multicolor focal plane arrays and detection devicesL3 CINCINNATI ELECTRONICS CORP·Filed 2020·Granted Aug 9, 2022·1 cites·18 claims
- 0479US10714531B2Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the sameL3 CINCINNATI ELECTRONICS CORP·Filed 2018·Granted Jul 14, 2020·1 cites·36 claims
- 0579US9246061B2LED having vertical contacts redistruted for flip chip mountingLEI JIPU·Filed 2012·Granted Jan 26, 2016·6 cites·9 claims
- 0677US9548408B2Tunneling barrier infrared detector devicesL-3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·2 cites·12 claims
- 0774US10121922B2Tunneling barrier infrared detector devicesL3 CINCINNATI ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·1 cites·18 claims
- 0874US9385285B2LED module with high index lensBIERHUIZEN SERGE J·Filed 2009·Granted Jul 5, 2016·5 cites·3 claims
- 0973US8400064B2Zener diode protection network in submount for LEDs connected in seriesWEI YAJUN·Filed 2009·Granted Mar 19, 2013·7 cites·14 claims
- 1072US8912049B2PEC biasing technique for LEDsWEI YAJUN·Filed 2011·Granted Dec 16, 2014·3 cites·15 claims
- 1169US10978508B2Infrared detector having a directly bonded silicon substrate present on top thereofL3 CINCINNATI ELECTRONICS CORP·Filed 2019·Granted Apr 13, 2021·1 cites·13 claims
- 1266US9219209B2P-N separation metal fill for flip chip LEDsLEI JIPU·Filed 2012·Granted Dec 22, 2015·2 cites·20 claims
- 1365US9093630B2Light emitting device with reduced EPI stressDIANA FREDERIC STEPHANE·Filed 2011·Granted Jul 28, 2015·1 cites·6 claims
- 1464US11587971B2Infrared detector having a directly bonded silicon substrate present on top thereofL3 CINCINNATI ELECTRONICS CORP·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1562US2025231114A1Image sensor with oxide free wafer bonded structures and methods for fabricating image sensorsKLA CORP·Filed 2024·Application pending·0 cites
- 1661US11515353B2Mechanically stacked multicolor focal plane arrays and detection devicesL3 CINCINNATI ELECTRONICS CORP·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1759US10886325B2Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the sameL3 CINCINNATI ELECTRONICS CORP·Filed 2018·Granted Jan 5, 2021·0 cites·22 claims
- 1859US10170653B2Tunneling barrier infrared detector devicesL3 CINCINNATI ELECTRONICS CORP·Filed 2017·Granted Jan 1, 2019·0 cites·14 claims
- 1957US10121921B2Tunneling barrier infrared detector devicesL3 CINCINNATI ELECTRONICS CORP·Filed 2016·Granted Nov 6, 2018·0 cites·8 claims
- 2056US10170675B2P—N separation metal fill for flip chip LEDsLUMILEDS LLC·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 2153US9887307B2Diode barrier infrared detector devices and barrier superlattice structuresL 3 COMMUNICATIONS CINCINNATI ELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·0 cites·8 claims
- 2252US9755124B2LED module with high index lensKONINKLIJKE PHILIPS NV·Filed 2016·Granted Sep 5, 2017·0 cites·6 claims
- 2352US9722137B2LED having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2016·Granted Aug 1, 2017·0 cites·6 claims
- 2452US9722161B2P-n separation metal fill for flip chip LEDsKONINKLIJKE PHILIPS NV·Filed 2015·Granted Aug 1, 2017·0 cites·19 claims
- 2552US2018019370A1Led having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2017·Application pending·0 cites
- 2650US9660164B2Light emitting device with reduced epi stressKONINKLIJKE PHILIPS NV·Filed 2015·Granted May 23, 2017·0 cites·12 claims
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