Inventor · disambiguated record
Alan J. Magnus
Also filed as: MAGNUS ALAN J
24 granted patents·1 pending application·157 citations·filing 1997–2020
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US8822268B1Redistributed chip packages containing multiple components and methods for the fabrication thereofMAGNUS ALAN J·Filed 2013·Granted Sep 2, 2014·32 cites·20 claims
- 0290US9401338B2Electronic devices with embedded die interconnect structures, and methods of manufacture thereofMAGNUS ALAN J·Filed 2012·Granted Jul 26, 2016·42 cites·19 claims
- 0388US8138062B2Electrical coupling of wafer structuresLIU LIANJUN·Filed 2009·Granted Mar 20, 2012·16 cites·20 claims
- 0485US8841758B2Semiconductor device package and method of manufactureDANIELS DWIGHT L·Filed 2012·Granted Sep 23, 2014·9 cites·19 claims
- 0584US9281286B1Microelectronic packages having texturized solder pads and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 0680US9070669B2Wettable lead ends on a flat-pack no-lead microelectronic packageFREESCALE SEMICONDUCTOR INC·Filed 2012·Granted Jun 30, 2015·6 cites·20 claims
- 0778US10340251B2Method for making an electronic component packageNXP USA INC·Filed 2017·Granted Jul 2, 2019·3 cites·18 claims
- 0877US9455216B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 27, 2016·2 cites·20 claims
- 0977US8685790B2Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2012·Granted Apr 1, 2014·5 cites·12 claims
- 1075US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 1173US9401339B2Wafer level packages having non-wettable solder collars and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Jul 26, 2016·3 cites·20 claims
- 1272US11450616B2Using a backside mask layer for forming a unique die mark identifier patternNXP USA INC·Filed 2020·Granted Sep 20, 2022·1 cites·17 claims
- 1372US9346671B2Shielding MEMS structures during wafer dicingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 24, 2016·2 cites·16 claims
- 1467US10998231B2Method for increasing semiconductor device wafer strengthNXP USA INC·Filed 2019·Granted May 4, 2021·1 cites·16 claims
- 1567US9997492B2Optically-masked microelectronic packages and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Jun 12, 2018·2 cites·20 claims
- 1665US9691743B2Localized redistribution layer structure for embedded component package and methodFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 27, 2017·1 cites·11 claims
- 1762US7892950B2Methodology for processing a panel during semiconductor device fabricationFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Feb 22, 2011·2 cites·19 claims
- 1857US9093436B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·0 cites·10 claims
- 1956US7132303B2Stacked semiconductor device assembly and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Nov 7, 2006·7 cites·30 claims
- 2054US10056360B2Localized redistribution layer structure for embedded component package and methodNXP USA INC·Filed 2017·Granted Aug 21, 2018·0 cites·20 claims
- 2150US2014167247A1Semiconductor device package having backside contact and method for manufacturingMAGNUS ALAN J·Filed 2014·Application pending·0 cites
- 2246US9458012B2Method for shielding MEMS structures during front side wafer dicingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 4, 2016·0 cites·7 claims
- 2344US9281293B2Microelectronic packages having layered interconnect structures and methods for the manufacture thereofMAGNUS ALAN J·Filed 2013·Granted Mar 8, 2016·0 cites·20 claims
- 2444US6248664B1Method of forming a contactSEMICONDUCTOR COMPONENTS IND·Filed 1997·Granted Jun 19, 2001·12 cites·16 claims
- 2536US8962389B2Microelectronic packages including patterned die attach material and methods for the fabrication thereofSTERMER JR WILLIAM C·Filed 2013·Granted Feb 24, 2015·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →