Inventor · disambiguated record
Dwight L. Daniels
Also filed as: DANIELS DWIGHT · DANIELS DWIGHT L · DANIELS DWIGHT LEE
22 granted patents·3 pending applications·462 citations·filing 1997–2024
95Inventor score
Top patents by PatentIndex Score
25 records- 0194US6201186B1Electronic component assembly and method of making the sameMOTOROLA INC·Filed 1998·Granted Mar 13, 2001·202 cites·15 claims
- 0293US9443782B1Method of bond pad protection during wafer processingFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 13, 2016·15 cites·16 claims
- 0390US9818656B1Devices and methods for testing integrated circuit devicesNXP USA INC·Filed 2017·Granted Nov 14, 2017·8 cites·20 claims
- 0490US8476087B2Methods for fabricating sensor device package using a sealing structureHOOPER STEPHEN R·Filed 2011·Granted Jul 2, 2013·14 cites·19 claims
- 0589US5973337ABall grid device with optically transmissive coatingMOTOROLA INC·Filed 1997·Granted Oct 26, 1999·106 cites·10 claims
- 0685US8841758B2Semiconductor device package and method of manufactureDANIELS DWIGHT L·Filed 2012·Granted Sep 23, 2014·9 cites·19 claims
- 0784US8384168B2Sensor device with sealing structureFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 26, 2013·8 cites·20 claims
- 0884US7985659B1Semiconductor device with a controlled cavity and method of formationFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Jul 26, 2011·5 cites·20 claims
- 0980US9070669B2Wettable lead ends on a flat-pack no-lead microelectronic packageFREESCALE SEMICONDUCTOR INC·Filed 2012·Granted Jun 30, 2015·6 cites·20 claims
- 1078US6303978B1Optical semiconductor component and method of manufactureMOTOROLA INC·Filed 2000·Granted Oct 16, 2001·33 cites·29 claims
- 1177US9455216B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Sep 27, 2016·2 cites·20 claims
- 1275US10658303B1High aspect ratio connection for EMI shieldingNXP USA INC·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 1372US11127645B2Grounding lids in integrated circuit devicesNXP USA INC·Filed 2019·Granted Sep 21, 2021·1 cites·20 claims
- 1469US9598280B2Environmental sensor structureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 21, 2017·2 cites·20 claims
- 1567US10381295B2Lead frame having redistribution layerNXP USA INC·Filed 2017·Granted Aug 13, 2019·1 cites·20 claims
- 1660US2024379474A1A packaged semiconductor device and method of manufacturing the sameNXP USA INC·Filed 2024·Application pending·0 cites
- 1757US9093436B2Semiconductor device package and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jul 28, 2015·0 cites·10 claims
- 1856US12119316B2Patterned and planarized under-bump metallizationNXP USA INC·Filed 2022·Granted Oct 15, 2024·0 cites·18 claims
- 1956US6139079AUniversal transport apparatusMOTOROLA INC·Filed 1997·Granted Oct 31, 2000·21 cites·3 claims
- 2056US2025079335A1Vibration isolation assemblies for electronic devicesNXP USA INC·Filed 2023·Application pending·0 cites
- 2155US2024425367A1Die stacking with controlled angular alignmentNXP USA INC·Filed 2023·Application pending·0 cites
- 2253US6103548ASemiconductor device and method of manufactureMOTOROLA INC·Filed 1997·Granted Aug 15, 2000·19 cites·9 claims
- 2352US8378433B2Semiconductor device with a controlled cavity and method of formationFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
- 2451US10892229B2Media shield with EMI capability for pressure sensorNXP USA INC·Filed 2019·Granted Jan 12, 2021·0 cites·11 claims
- 2538US5903051AElectronic component and method of manufactureMOTOROLA INC·Filed 1998·Granted May 11, 1999·8 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →