Inventor · disambiguated record
Krishna Vepa
Also filed as: VEPA KRISHNA
11 granted patents·8 pending applications·148 citations·filing 2001–2011
89Inventor score
Files withAPPLIED MATERIALS INC7WAFER SOLUTIONS INC3VEPA KRISHNA2APPLIED MATREIALS INC1NEUBER ANDREAS1
Top patents by PatentIndex Score
19 records- 0188US7208325B2Refreshing wafers having low-k dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·13 cites·7 claims
- 0288US6672943B2Eccentric abrasive wheel for wafer processingWAFER SOLUTIONS INC·Filed 2001·Granted Jan 6, 2004·67 cites·19 claims
- 0381US7402520B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2004·Granted Jul 22, 2008·23 cites·15 claims
- 0480US7775856B2Method for removal of surface films from reclaim substratesAPPLIED MATERIALS INC·Filed 2007·Granted Aug 17, 2010·9 cites·13 claims
- 0575US7951718B2Edge removal of silicon-on-insulator transfer waferAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·4 cites·20 claims
- 0674US6852012B2Cluster tool systems and methods for in fab wafer processingWAFER SOLUTIONS INC·Filed 2001·Granted Feb 8, 2005·28 cites·19 claims
- 0766US7659206B2Removal of silicon oxycarbide from substratesAPPLIED MATERIALS INC·Filed 2006·Granted Feb 9, 2010·2 cites·19 claims
- 0865US7657390B2Reclaiming substrates having defects and contaminantsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 2, 2010·2 cites·34 claims
- 0950US7727782B2Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factoryAPPLIED MATERIALS INC·Filed 2007·Granted Jun 1, 2010·0 cites·17 claims
- 1046US7695982B2Refurbishing a wafer having a low-k dielectric layerAPPLIED MATREIALS INC·Filed 2007·Granted Apr 13, 2010·0 cites·22 claims
- 1141US8874416B2Process tool chemical and gas usage optimizationVEPA KRISHNA·Filed 2011·Granted Oct 28, 2014·0 cites·20 claims
- 1241US2010249968A1Factory resource optimization identification process and systemNEUBER ANDREAS·Filed 2010·Application pending·0 cites
- 1338US2008318343A1Wafer reclaim method based on wafer typeVEPA KRISHNA·Filed 2007·Application pending·0 cites
- 1428US2002086625A1Vacuum mount wafer polishing methods and apparatusWAFER SOLUTIONS INC·Filed 2001·Application pending·0 cites
- 1527US2002004265A1Grind polish cluster and methods to remove visual grind patternFiled 2001·Application pending·0 cites
- 1627US2001023082A1Grind and single wafer etch process to remove metallic contamination in silicon wafersFiled 2001·Application pending·0 cites
- 1727US2002052116A1Free Floating double side polishing of substratesFiled 2001·Application pending·0 cites
- 1827US2002090799A1Substrate grinding systems and methods to reduce dot depth variationFiled 2001·Application pending·0 cites
- 1927US2002052169A1Systems and methods to significantly reduce the grinding marks in surface grinding of semiconductor wafersFiled 2001·Application pending·0 cites
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