Inventor · disambiguated record
Jong-Yun Myung
Also filed as: MYUNG JONG-YUN
4 granted patents·9 citations·filing 2011–2014
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0178US8922008B2Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·5 cites·14 claims
- 0265US9159688B2Semiconductor device including a solder and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 13, 2015·2 cites·23 claims
- 0358US8563349B2Method of forming semiconductor deviceMYUNG JONG-YUN·Filed 2011·Granted Oct 22, 2013·2 cites·5 claims
- 0437US8304288B2Methods of packaging semiconductor devices including bridge patternsLEE HYUEK-JAE·Filed 2011·Granted Nov 6, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →