Inventor · disambiguated record
Honchin En
Also filed as: EN HONCHIN
18 granted patents·426 citations·filing 1998–2009
96Inventor score
Top patents by PatentIndex Score
18 records- 0197US7691189B2Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 2007·Granted Apr 6, 2010·57 cites·18 claims
- 0296US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 0394US8018045B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Sep 13, 2011·18 cites·23 claims
- 0493US8065794B2Printed wiring board and its manufacturing methodEN HONCHIN·Filed 2008·Granted Nov 29, 2011·26 cites·1 claims
- 0593US7993510B2Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Aug 9, 2011·22 cites·2 claims
- 0693US7535095B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted May 19, 2009·59 cites·13 claims
- 0791US8020291B2Method of manufacturing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Sep 20, 2011·13 cites·10 claims
- 0889US8006377B2Method for producing a printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 30, 2011·9 cites·13 claims
- 0987US8030577B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·9 cites·15 claims
- 1087US6242079B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Jun 5, 2001·67 cites·16 claims
- 1185US7812262B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Oct 12, 2010·9 cites·4 claims
- 1284US7230188B1Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 1999·Granted Jun 12, 2007·55 cites·16 claims
- 1382US7994433B2Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 2009·Granted Aug 9, 2011·6 cites·8 claims
- 1477US7446263B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Nov 4, 2008·15 cites·4 claims
- 1576US8093507B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Jan 10, 2012·3 cites·19 claims
- 1675US8533943B2Printed wiring board and method for producing the sameEN HONCHIN·Filed 2009·Granted Sep 17, 2013·4 cites·7 claims
- 1769US7827680B2Electroplating process of electroplating an elecrically conductive sustrateIBIDEN CO LTD·Filed 2004·Granted Nov 9, 2010·11 cites·1 claims
- 1869US7514637B1Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 7, 2009·10 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →