Inventor · disambiguated record
Francisca Tung
Also filed as: TUNG FRANCISCA
8 granted patents·1,249 citations·filing 1985–2002
92Inventor score
Files withDIGITAL EQUIPMENT CORP3ADVANPACK SOLUTIONS PTE LTD2ADVANPAK SOLUTIONS PTE LTD1VLSI TECHNOLOGY1VLSI TECHNOLOGY INC1
Top patents by PatentIndex Score
8 records- 0198US6578754B1Pillar connections for semiconductor chips and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2000·Granted Jun 17, 2003·546 cites·9 claims
- 0296US6592019B2Pillar connections for semiconductor chips and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jul 15, 2003·216 cites·9 claims
- 0396US5072075ADouble-sided hybrid high density circuit board and method of making sameDIGITAL EQUIPMENT CORP·Filed 1989·Granted Dec 10, 1991·206 cites·14 claims
- 0494US6681982B2Pillar connections for semiconductor chips and method of manufactureADVANPAK SOLUTIONS PTE LTD·Filed 2002·Granted Jan 27, 2004·143 cites·6 claims
- 0569US4692839AMultiple chip interconnection system and packageDIGITAL EQUIPMENT CORP·Filed 1985·Granted Sep 8, 1987·37 cites·15 claims
- 0668US5587336ABump formation on yielded semiconductor diesVLSI TECHNOLOGY·Filed 1994·Granted Dec 24, 1996·46 cites·3 claims
- 0756US5342495AStructure for holding integrated circuit dies to be electroplatedVLSI TECHNOLOGY INC·Filed 1993·Granted Aug 30, 1994·34 cites·8 claims
- 0851US5387495ASequential multilayer process for using fluorinated hydrocarbons as a dielectricDIGITAL EQUIPMENT CORP·Filed 1992·Granted Feb 7, 1995·21 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Francisca Tung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →